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Design and manufacturing of liquid-cooled SiC power modules for EV applications

Design and manufacturing of liquid-cooled SiC power modules for EV applications
用于电动汽车应用的液冷SiC功率模块的设计和制造
批准号:
570515-2021
负责人:
Ng, WaiTung
金额:
$18.29万
依托单位:
依托单位国家:
加拿大
项目类别:
Alliance Grants
财政年份:
2021
资助国家:
加拿大
项目状态:
已结题
起止时间:
2021-01-01 至 2022-12-31

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英文摘要
The development of Electric Vehicles (EV) is one of the key measures to combat the accelerating climate change. The opportunity to develop the Canadian EV industry is better than ever. Provincial and Federal governments are investing "hundreds of millions" of dollars to create new jobs, stirring hopes to put Canada on the map as EV manufacturers. While much of the initial focus is placed on the manufacturing of low cost, high-capacity batteries, there are plenty of market space to develop complementary automotive parts. Researchers at the University of Toronto Electric Vehicle (UTEV) Research Centre, in partnership with Dana Canada Corporation (Oakville, ON) and Dana TM4 (Boucherville, QC), propose to design and develop manufacturing techniques for high performance liquid-cooled Silicon-Carbide (SiC) intelligent power modules (IMPs). Building on existing know how, UTEV plans to scale up the direct die bonding techniques for Gallium-Nitride (GaN) power modules, developed previously with Dana Canada, to build liquid-cooled SiC power modules capable of delivering more than 100 kW for the EV's charging and drive systems. Some of the challenges to overcome include the development of direct bonding techniques such as metal brazing and silver sintering, to provide low thermal resistance and high reliability. In addition, the physical layout and structure of the IMPs has conflicting requirements for the optimization of electrical and thermal performance. The development of smart gate driver ICs can also adds novel features such as digital interface, Electro-Magnetic Interference (EMI) suppression, aging and health monitoring to the IMPs. UTEV plans to demonstrate the implementation of high efficiency power converters using these SiC IMP prototypes. Theses power converters will also be installed on UTEV's EV rolling chassis to evaluate the real-world drive cycle performance. At the same time, Dana Canada will ensure that the fabrication techniques are compatible with the stringent automotive manufacturing requirements.
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Wide Bandgap Power Semiconductor Devices for Next Generation Smart Power Electronics
  • 批准号:
    RGPIN-2019-04462
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $3.35万
  • 财政年份:
    2022
  • 负责人:
    Ng, WaiTung
  • 依托单位:
CMOS Process Sensors and Design Methodology in Advanced Technology Nodes
  • 批准号:
    543852-2019
  • 项目类别:
    Collaborative Research and Development Grants
  • 资助金额:
    $8.41万
  • 财政年份:
    2021
  • 负责人:
    Ng, WaiTung
  • 依托单位:
Wide Bandgap Power Semiconductor Devices for Next Generation Smart Power Electronics
  • 批准号:
    RGPIN-2019-04462
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $3.35万
  • 财政年份:
    2021
  • 负责人:
    Ng, WaiTung
  • 依托单位:
MOST - Manufacturing and applications of GaN power semiconductor devices/modules
  • 批准号:
    521470-2018
  • 项目类别:
    Strategic Projects - Group
  • 资助金额:
    $14.72万
  • 财政年份:
    2020
  • 负责人:
    Ng, WaiTung
  • 依托单位:
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