Design and manufacturing of liquid-cooled SiC power modules for EV applications

用于电动汽车应用的液冷SiC功率模块的设计和制造

基本信息

  • 批准号:
    570515-2021
  • 负责人:
  • 金额:
    $ 18.29万
  • 依托单位:
  • 依托单位国家:
    加拿大
  • 项目类别:
    Alliance Grants
  • 财政年份:
    2021
  • 资助国家:
    加拿大
  • 起止时间:
    2021-01-01 至 2022-12-31
  • 项目状态:
    已结题

项目摘要

The development of Electric Vehicles (EV) is one of the key measures to combat the accelerating climate change. The opportunity to develop the Canadian EV industry is better than ever. Provincial and Federal governments are investing "hundreds of millions" of dollars to create new jobs, stirring hopes to put Canada on the map as EV manufacturers. While much of the initial focus is placed on the manufacturing of low cost, high-capacity batteries, there are plenty of market space to develop complementary automotive parts. Researchers at the University of Toronto Electric Vehicle (UTEV) Research Centre, in partnership with Dana Canada Corporation (Oakville, ON) and Dana TM4 (Boucherville, QC), propose to design and develop manufacturing techniques for high performance liquid-cooled Silicon-Carbide (SiC) intelligent power modules (IMPs). Building on existing know how, UTEV plans to scale up the direct die bonding techniques for Gallium-Nitride (GaN) power modules, developed previously with Dana Canada, to build liquid-cooled SiC power modules capable of delivering more than 100 kW for the EV's charging and drive systems. Some of the challenges to overcome include the development of direct bonding techniques such as metal brazing and silver sintering, to provide low thermal resistance and high reliability. In addition, the physical layout and structure of the IMPs has conflicting requirements for the optimization of electrical and thermal performance. The development of smart gate driver ICs can also adds novel features such as digital interface, Electro-Magnetic Interference (EMI) suppression, aging and health monitoring to the IMPs. UTEV plans to demonstrate the implementation of high efficiency power converters using these SiC IMP prototypes. Theses power converters will also be installed on UTEV's EV rolling chassis to evaluate the real-world drive cycle performance. At the same time, Dana Canada will ensure that the fabrication techniques are compatible with the stringent automotive manufacturing requirements.
发展电动汽车是应对日益加剧的气候变化的关键措施之一。发展加拿大电动汽车产业的机会比以往任何时候都好。省政府和联邦政府正在投资“数亿”美元来创造新的就业机会,这激起了加拿大成为电动汽车制造商的希望。虽然最初的重点主要放在制造低成本、高容量的电池上,但开发配套汽车零部件的市场空间很大。多伦多大学电动汽车(UTEV)研究中心的研究人员与Dana Canada Corporation (Oakville, ON)和Dana TM4 (Boucherville, QC)合作,提出设计和开发高性能液冷碳化硅(SiC)智能功率模块(IMPs)的制造技术。在现有技术的基础上,UTEV计划扩大氮化镓(GaN)功率模块的直接模具键合技术,该技术之前与加拿大德纳公司(Dana Canada)共同开发,用于制造能够为电动汽车充电和驱动系统提供超过100千瓦功率的液冷SiC功率模块。需要克服的一些挑战包括开发直接粘合技术,如金属钎焊和银烧结,以提供低热阻和高可靠性。此外,imp的物理布局和结构在优化电学和热学性能方面存在矛盾。智能栅极驱动ic的发展还可以为imp增加数字接口、电磁干扰抑制、老化和健康监测等新功能。UTEV计划使用这些SiC IMP原型来演示高效功率转换器的实现。这些电源转换器还将安装在UTEV的电动汽车滚动底盘上,以评估实际驱动循环性能。同时,德纳加拿大将确保制造技术符合严格的汽车制造要求。

项目成果

期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)

数据更新时间:{{ journalArticles.updateTime }}

{{ item.title }}
{{ item.translation_title }}
  • DOI:
    {{ item.doi }}
  • 发表时间:
    {{ item.publish_year }}
  • 期刊:
  • 影响因子:
    {{ item.factor }}
  • 作者:
    {{ item.authors }}
  • 通讯作者:
    {{ item.author }}

数据更新时间:{{ journalArticles.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ monograph.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ sciAawards.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ conferencePapers.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ patent.updateTime }}

Ng, WaiTung其他文献

Ng, WaiTung的其他文献

{{ item.title }}
{{ item.translation_title }}
  • DOI:
    {{ item.doi }}
  • 发表时间:
    {{ item.publish_year }}
  • 期刊:
  • 影响因子:
    {{ item.factor }}
  • 作者:
    {{ item.authors }}
  • 通讯作者:
    {{ item.author }}

{{ truncateString('Ng, WaiTung', 18)}}的其他基金

Wide Bandgap Power Semiconductor Devices for Next Generation Smart Power Electronics
用于下一代智能电力电子的宽带隙功率半导体器件
  • 批准号:
    RGPIN-2019-04462
  • 财政年份:
    2022
  • 资助金额:
    $ 18.29万
  • 项目类别:
    Discovery Grants Program - Individual
CMOS Process Sensors and Design Methodology in Advanced Technology Nodes
先进技术节点中的 CMOS 工艺传感器和设计方法
  • 批准号:
    543852-2019
  • 财政年份:
    2021
  • 资助金额:
    $ 18.29万
  • 项目类别:
    Collaborative Research and Development Grants
Wide Bandgap Power Semiconductor Devices for Next Generation Smart Power Electronics
用于下一代智能电力电子的宽带隙功率半导体器件
  • 批准号:
    RGPIN-2019-04462
  • 财政年份:
    2021
  • 资助金额:
    $ 18.29万
  • 项目类别:
    Discovery Grants Program - Individual
MOST - Manufacturing and applications of GaN power semiconductor devices/modules
MOST - GaN功率半导体器件/模块的制造和应用
  • 批准号:
    521470-2018
  • 财政年份:
    2020
  • 资助金额:
    $ 18.29万
  • 项目类别:
    Strategic Projects - Group
CMOS Process Sensors and Design Methodology in Advanced Technology Nodes
先进技术节点中的 CMOS 工艺传感器和设计方法
  • 批准号:
    543852-2019
  • 财政年份:
    2020
  • 资助金额:
    $ 18.29万
  • 项目类别:
    Collaborative Research and Development Grants
Wide Bandgap Power Semiconductor Devices for Next Generation Smart Power Electronics
用于下一代智能电力电子的宽带隙功率半导体器件
  • 批准号:
    RGPIN-2019-04462
  • 财政年份:
    2020
  • 资助金额:
    $ 18.29万
  • 项目类别:
    Discovery Grants Program - Individual
Wide Bandgap Power Semiconductor Devices for Next Generation Smart Power Electronics
用于下一代智能电力电子的宽带隙功率半导体器件
  • 批准号:
    RGPIN-2019-04462
  • 财政年份:
    2019
  • 资助金额:
    $ 18.29万
  • 项目类别:
    Discovery Grants Program - Individual
CMOS Process Sensors and Design Methodology in Advanced Technology Nodes
先进技术节点中的 CMOS 工艺传感器和设计方法
  • 批准号:
    543852-2019
  • 财政年份:
    2019
  • 资助金额:
    $ 18.29万
  • 项目类别:
    Collaborative Research and Development Grants
MOST - Manufacturing and applications of GaN power semiconductor devices/modules
MOST - GaN功率半导体器件/模块的制造和应用
  • 批准号:
    521470-2018
  • 财政年份:
    2019
  • 资助金额:
    $ 18.29万
  • 项目类别:
    Strategic Projects - Group
Gallium Nitride (GaN) Power Transistors, Gate Driving Techniques and Next Generation Integrated Power Converters
氮化镓 (GaN) 功率晶体管、栅极驱动技术和下一代集成功率转换器
  • 批准号:
    RGPIN-2014-04556
  • 财政年份:
    2018
  • 资助金额:
    $ 18.29万
  • 项目类别:
    Discovery Grants Program - Individual

相似海外基金

CAREER: Manufacturing of Solid Particle-Liquid Metal Mixtures for Soft Robotics and Stretchable Electronics
职业:制造用于软机器人和可拉伸电子产品的固体颗粒-液体金属混合物
  • 批准号:
    2339780
  • 财政年份:
    2024
  • 资助金额:
    $ 18.29万
  • 项目类别:
    Standard Grant
SBIR Phase I: Liquid-Enabled Advanced Pitch (LEAP) Semiconductor Manufacturing
SBIR 第一阶段:液体先进间距 (LEAP) 半导体制造
  • 批准号:
    2304119
  • 财政年份:
    2023
  • 资助金额:
    $ 18.29万
  • 项目类别:
    Standard Grant
Characterizing chemical threat agent exposures using a lung-on-a-chip platform and multi-omic analysis of common pathophysiological mechanisms
使用芯片肺平台和常见病理生理机制的多组学分析来表征化学威胁剂暴露
  • 批准号:
    10708553
  • 财政年份:
    2023
  • 资助金额:
    $ 18.29万
  • 项目类别:
Novel Bioprinted Neural Stem Cell-Embedded Hydrogel Matrices for Enhanced Treatment of Glioblastoma
新型生物打印神经干细胞嵌入水凝胶基质,用于增强胶质母细胞瘤的治疗
  • 批准号:
    10749330
  • 财政年份:
    2023
  • 资助金额:
    $ 18.29万
  • 项目类别:
Development of a Colorimetric Sensor for Detection of Cerebrospinal Fluid Leaks
开发用于检测脑脊液泄漏的比色传感器
  • 批准号:
    10602859
  • 财政年份:
    2023
  • 资助金额:
    $ 18.29万
  • 项目类别:
Targeting Macrophages to Treat Soft Tissue Sarcomas
靶向巨噬细胞治疗软组织肉瘤
  • 批准号:
    10760719
  • 财政年份:
    2023
  • 资助金额:
    $ 18.29万
  • 项目类别:
An Aptamer-directed IgG1-Fc Drug Conjugate (AFDC) for Treating Pancreatic Cancer
用于治疗胰腺癌的适体导向 IgG1-Fc 药物偶联物 (AFDC)
  • 批准号:
    10761053
  • 财政年份:
    2023
  • 资助金额:
    $ 18.29万
  • 项目类别:
Nanodisc Platform for 19F-MRI
用于 19F-MRI 的 Nanodisc 平台
  • 批准号:
    10746675
  • 财政年份:
    2023
  • 资助金额:
    $ 18.29万
  • 项目类别:
Enabling Subcutaneous Delivery of Therapeutic Monoclonal Antibodies via Hydrogel Microparticles
通过水凝胶微粒皮下输送治疗性单克隆抗体
  • 批准号:
    10761250
  • 财政年份:
    2023
  • 资助金额:
    $ 18.29万
  • 项目类别:
MASTER Scaffolds for Rapid, Single-Step Manufacture and Prototyping of CAR-T cells
用于快速、单步制造 CAR-T 细胞和原型制作的 MASTER 支架
  • 批准号:
    10713795
  • 财政年份:
    2023
  • 资助金额:
    $ 18.29万
  • 项目类别:
{{ showInfoDetail.title }}

作者:{{ showInfoDetail.author }}

知道了