Smart Sensors: Manufacture, Functionalize, Power-up and Integrate

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The manufacturing and integration of autonomous and embedded sensors through a combination of micro-- and nano--systems technologies have been revolutionizing self--powered, high bandwidth devices for advanced manufacturing (AM), artificial intelligence (AI), Internet of Things (IoT), and health technologies. More specifically, nano- and micro-scale sensors are the building blocks for a vast range of applications, from health and environmental (such as gas, biomolecules, pressure, temperature) monitoring to wireless Internet services. As these devices have numbered in the tens of billions, the potential for disruptive innovation is immense. Integrating micro- and nano--sensors to portable circuit boards (PCBs) and their electro--mechanical packaging are very challenging. The integration and packaging of these devices require the multiple deposition of layers of different dielectrics and metals. The atomic mismatch between these layers increases electrical resistance, creates noise and reduces sensitivity, and increase detection time. Moreover, cost reduction, scale up, compatibility, volume production, self-powering, and simplicity are very valuable additions, in addition to, high responsivity, high sensitivity, and high selectivity [Yavuz "Materials Design, Fabrication, Packaging and Reliability of Nano and Micro-Electro-Mechanical Systems (N/MEMS)", Wiley, 2019]. The proposed sensors developed through this research have the potential to improve our quality of life such as safer food and water and health monitoring, and securer environment and neighborhood. Therefore, the technology developed to manufacture these green and smart sensors will enhance Canada's economy, society and environment within the next 10 years [Infrastructure Canada (IC) "Building a Better Canada: A Progress Report on the Investing in Canada plan 2016-2019"; "Rural Opportunity, National Prosperity: An Economic Development Strategy for Rural Canada"]. The proposed program aims to educate and train highly qualified personnel (HQP) for addressing the "gap in knowledge, expertise and training in connected technologies such as AM, AI and IoT" identified by IC. The program will create a unique environment for innovation that unleashes the potential of HQP to develop cutting edge sensors by providing them with "broad interdisciplinary training and knowledge" from network- to bio-sensing in manufacturing, integrating, packaging and testing. HQP will be `job ready' and able to transition to the workforce as engineers, project managers and technology specialists. HQP trained through this innovative program will maximize knowledge transfer to critically important Canadian industries and public sectors. The training will be focused on project management, communication, work ethic, safety, equity, diversity and inclusion, equal employment opportunity (EEO), and intellectual property regulations as well.