FOR 1522: Multi-physical Synthesis and Integration of Complex Radio Frequency Circuits - MUSIK

微电子机械系统(MEMS)的关键部件是微米级的机械柔性器件，其机械运动可以通过电信号来激励和检测。研究单位致力于将MEMS在高频下的基本功能，如放大、控制、振荡和开关，纳入复杂射频(RF)电路的设计中。通过将器件、电路和系统级的微电子和微机械特性结合在一起，实现了一种新的电路技术--射频微机电一体化。因此，对RF-MEMS的研究重点从技术和单个器件层面转向面向应用的系统层面，例如用于移动通信。由于来自不同科学学科的研究人员的合作，研究单位的一个核心方法是多物理建模和仿真，它明确地说明了MEMS与它们的数学描述有关的耦合的电气和机械特性，以及电子和机械功能的物理不同影响，包括它们不需要的和需要的寄生。这种基本的方法伴随着一种衬底技术，该技术专为同时实现微电子和微机械设备而量身定做，即通过将硅和陶瓷技术融合到一种新的复合衬底(SiCer)中。只有这种最初在伊尔梅瑙理工大学IMN MicroNano®进行研究的方法才能实现微机械射频电路技术的后续实施。以下目标在互补子项目中共同解决、调查和验证：复杂射频电路的模型和系统设计与系统分析；集成微电子-微机电射频组件和电路；非理想射频MEMS的系统仿真和集成分析；跨越多个抽象层次的仿真和测试；SiCer衬底技术中的微机械和微电子集成；方法在选定的子系统方面的演示。

The key constituents of micro-electromechanical systems (MEMS) are mechanically flexible devices on the micrometre scale, where the mechanical motions can be excited and detected by electrical signals. The Research Unit aims at including the basic functions of MEMS at high frequencies, such as amplifying, controlling, oscillating and switching, into the design of complex radio frequency (RF) circuits. Through the combination of micro-electronic and micro-mechanic properties at device, circuit and system levels, a novel circuit technology "RF micromechatronics" is made accessible. As a consequence, the research focus on RF-MEMS is steered from the technology and single-device levels to an application-oriented system level, e.g., for mobile communications. Resulting from the cooperation of researchers from different scientific disciplines, a core approach of the Research Unit is the multi-physical modelling and simulation, which explicitly accounts for the coupled electric and mechanic properties of MEMS in relation to their mathematical description as well as the physically different effects of electronic and mechanic functions, including their unwanted and wanted parasictics. This fundamental approach is accompanied by a substrate technology tailored to the simultaneous implementation of micro-electronic and micro-mechanic devices, namely by merging silicon and ceramic technologies into a novel compound substrate (SiCer). Only this approach, originally investigated at the IMN MicroNano® at Ilmenau University of Technology, enables a consequent implementation of micro-electromechanical RF circuit technology. The following objectives are jointly addressed, investigated in complementary sub-projects and verified respectively demonstrated jointly: Model and system design and system analysis of complex RF circuits; integrated micro-electronic-micro-electromechanic RF components and circuits; system simulation and integration analysis of non-ideal RF MEMS; simulations and tests crossing multiple abstraction levels; micro-mechanic and micro-electronic integration in SiCer substrate technology; demonstration of the approach in terms of selected subsystems.