Directed Assembly: Integration of Heterogeneous Systems Across Length Scales and Material Boundaries

ECS-0601454H。雅各布斯大学明尼苏特-双子城摘要。这项提议的主要目标仍然是开发一种定向组装工艺，以实现包含不同部件的不同系统的组装，同时支持形成电气互连的能力。修订的目标是：1)流体搅拌概念，以悬浮不同的部分。2)新的方法，激活受体，实现可编程的自组装，并将芯片转移到表面上所需的位置。3)通过结合几何形状识别和表面张力定向自组装来减少缺陷。4)应用所获得的知识来制造包含用于传感、处理和通信的不同单元的传感器系统。通过将重点放在具有更容易获得的组件(50 Mm)的系统的组装上来缩小范围。因此，使用超声波的“关键化学”和搅拌就变得过时了。随着我们缩小到更小的芯片尺寸，这两者都将变得至关重要。如果有机会，我们将申请额外的资金，在未来探索这两个重要因素。智力上的功绩。这一提议的智力价值在于推进了一个新兴领域的知识，该领域可被称为定向组装、设计自组装或可编程自组装。重点是不同的系统和组件，其中包含由不同材料制成的不同物理尺寸的组件，这些组件无法使用机器人装配线、晶片到晶片转移技术或现有的自组装方法进行有效组装。将不同的微观部件(集成电路、光学部件、传感器、致动器、流体设备)组装成二维或三维的能力，将影响改进后的全新系统的创建，而这是目前的微机械加工和微组装技术无法实现的。应用包括收集光学、红外、紫外线、声学、化学和/或放射数据的传感器系统，这些数据将改善我们日常生活的许多领域，包括医疗保健、环境、能源、食品安全、制造和国家安全。

ECS-0601454H. Jacobs, Univ. of Minnesot-Twin CitiesSummary. The main goal of this proposal remains to develop a directed assembly process to enable the assembly of heterogeneous systems that contain non-identical parts, while supporting the ability of forming electrical interconnects. The revised objectives are:1) A fluidic agitation concept to suspend the disparate parts.2) A new method to activate receptors to enable programmable self-assembly and transfer of chiplets onto desired locations on a surface.3) Defect reduction by combining geometrical shape recognition with surface tension directed self-assembly. 4) Application of the gained knowledge to fabricate a sensor system that contains disparate units for sensing, processing, and communication.The scope is reduced by focusing on the assembly of systems with more readily available components that are 50 mm. Accordingly, the "key chemistry" and agitation using ultrasonification become obsolete. Both will become essential as we scale-down to smaller chip sizes. Given the opportunity we will apply for additional funding to explore these two important elements in the future. Intellectual Merit. The intellectual merit of this proposal is to advance knowledge in an emerging area that can be referred to as directed assembly, self-assembly-by-design, or programmable self-assembly. The focal points are heterogeneous systems and assemblies that contain components made of different materials with different physical dimensions that cannot be assembled effectively with robotic assembly lines, wafer-to-wafer transfer techniques, or existing self-assembly methods.Broader Impact. The ability to assemble disparate microscopic components (integrated circuits, optical components, sensors, actuators, fluidic devices) in two- or three dimensions would impact the creation of improved and entirely new systems that cannot be achieved with current micromachining and microassembly techniques. Applications include sensor systems to gather optical, IR, UV, acoustic, chemical, and/or radiological data that would improve many areas of our daily lives including healthcare, the environment, energy, food safety, manufacturing, and national security.