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EAGER/Collaborative Research: Electromagnetic Pulse Induced Cutting (EPIC) of Metallic Components

EAGER/Collaborative Research: Electromagnetic Pulse Induced Cutting (EPIC) of Metallic Components
EAGER/协作研究:金属部件的电磁脉冲感应切割 (EPIC)
批准号:
1103199
负责人:
Indranath Dutta
金额:
$5.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2011
资助国家:
美国
项目状态:
已结题
起止时间:
2011-02-01 至 2012-01-31

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中文摘要
翻译
这项探索性研究(EAGER)早期概念补助金的研究目标是展示一种新型制造工艺的概念验证,该工艺可以以无工具、自由成形的方式切割薄板和板材。这一过程被称为电磁脉冲感应切割,是基于在电磁和机械联合载荷下控制细裂纹的推进。该方法将利用与一系列电脉冲相关的电磁力来推进裂纹前沿,同时使用机械载荷来确定裂纹方向。实际上,目标是以高度控制的方式在板材上几乎任何方向移动裂缝。从概念上讲,这个过程类似于一个微型的、无工具的、以微米为单位测量切口的电磁拼图。作为拟议研究的一部分,将结合电磁洛伦兹力产生的原理,由于电流拥挤而在裂纹尖端局部加热,以及混合模式断裂力学,以使用简单的实验原型推导裂纹推进和转动所需的条件。如果成功,这项研究对社会的好处将包括出现一种新的制造工艺,用于精确切割易碎、难以加工的材料的中尺度薄板和箔。因此,这一过程有可能成为国家的一种新的使能技术。美国制造业基地。此外,该项目将通过促进两所美国大学研究生的发现和理解来整合研究和教育。
英文摘要
The research objective of this Early Concept Grant for Exploratory Research (EAGER) award is to demonstrate proof-of-concept of a novel manufacturing process for cutting thin sheet and plates in a tool-less, freeformed fashion. The process, termed Electromagnetic Pulse Induced Cutting, is based on the controlled advance of a fine crack under combined electromagnetic and mechanical loading. The approach will be to utilize electromagnetic forces associated with a series of electric pulses to advance the crack front while using a mechanical load to define the crack direction. In effect, the goal is to move a crack in a highly controlled manner in virtually any direction on a sheet or plate. Conceptually, the process is akin to a microsized, tool-less, electromagnetic jigsaw with a kerf measured in microns. As part of the proposed research, the principles of electromagnetic Lorentz force generation, localized heating at the crack-tip due to current-crowding, and mixed mode fracture mechanics will be combined to derive the conditions required to advance and turn the crack using a simple experimental prototype.If successful, the benefit to society of the research will include the emergence of a new manufacturing process for precision-cutting of mesoscale thin sheets and foils of brittle, hard-to-process materials. As such, the process has the potential to serve as a new enabling technology for the nation?s manufacturing base. In addition, this project will integrate research and education by advancing discovery and understanding by graduate students at two American universities.
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Collaborative Research: Mechanisms and Processing Strategies for Sn Whisker Mitigation
  • 批准号:
    1335491
  • 项目类别:
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  • 资助金额:
    $28.0万
  • 财政年份:
    2013
  • 负责人:
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  • 项目类别:
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  • 资助金额:
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  • 财政年份:
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  • 负责人:
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  • 依托单位:
Collaborative Research: Electromagnetic Pulse Cutting of Metallic Components
  • 批准号:
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  • 项目类别:
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  • 资助金额:
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  • 财政年份:
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  • 批准号:
    1100900
  • 项目类别:
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  • 资助金额:
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  • 财政年份:
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  • 负责人:
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  • 依托单位:
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