CSR: Small: Collaborative Research: Cross-Layer Design Techniques for Robustness of the Next-Generation Nonvolatile Memories

研究的目的是开发设计技术，以缓解下一代非易失性存储器的一般健壮性问题，同时保持甚至改善通用存储器的规格，如密度、功耗和性能。从体系结构、电路和器件层集成了全面的解决方案，以提高新兴非易失性存储器的密度、成本和可靠性。设计技术包括1)用于多级单元器件的新的写入耐久性改进技术，以通过应用由独立电路监视和控制的编码和磨损均衡技术来延长新的非易失性存储器的寿命；2)自参考和其他自适应感测技术，以克服工艺变化和器件磨损机制的影响，以提高成品率。以及3)新的交错3D堆叠存储器集成方案和外围电路设计，以增加在一定高度内集成的堆栈的数量。研究的更广泛的影响在于揭示了应用跨层设计技术来解决下一代网络管理系统健壮性问题的重要性以及对健壮性设计环境的关注。通过研究创新，系统架构师、电路设计师和器件集成工程师可以很好地沟通和教育。所开发的技术可以在与多个行业合作伙伴的密切合作下直接转化为行业应用，并直接影响未来的计算系统。协作中的活动还包括在各主要会议上就项目的技术方面和新课程的开发提供指导。

The objective of the research is to develop design technologies that can alleviate the general robustness issues of the next-generation nonvolatile memories while maintaining and even improving the generic memory specifications such as density, power and performance. Comprehensive solutions are integrated from architecture, circuit and device layers for the improvement on the density, cost and reliability of emerging nonvolatile memories. The design techniques include 1) a new write endurance improvement technique for multi-level cell devices to prolong the lifetime of the new nonvolatile memories by applying the coding and wear-leveling techniques that are monitored and controlled by self-contained circuits; 2) self-reference and other adaptive sensing techniques to overcome the impacts of process variations and device wear-out mechanisms for yield improvement.; and 3) a new interleaved 3D-stacking memory integration scheme and peripheral circuit design to increase the number of stacks integrated within a certain height. The broader impact of the research lies in revealing the importance of applying cross-layer design techniques to resolve the robustness issues of the next-generation NVMs and the attentions to the robust design context. The system architects, the circuit designers and the device integration engineers can be well bridged and educated by the research innovations. The developed techniques can be directly transferred to industry applications under the close collaborations with several industry partners, and directly impact the future computing systems. The activities in the collaboration also include the tutorials in the major conferences on the technical aspects of the projects and new course development.