CAREER: Opportunistic Through-Silicon-Via Utilization: Device, Circuit and Design Automation Perspectives

这种三维集成电路(3DIC)使用直通硅通孔(TSV)在垂直维度上堆叠多个芯片，从而显著减少了占地面积、功耗和延迟。虽然与3D IC相关的许多挑战仍然存在，但该项目针对的是一个在未来5到10年内将变得越来越重要并可能终止3D IC生产的挑战：TSV的尺寸相当大，但由于晶片处理和纵横比的限制，它们的直径不能与设备一起缩放。另一方面，需要大量的TSV来传递信号和功率、散热和提供冗余。此外，为了在化学和机械抛光(CMP)过程中保持晶片的平面性，铸造厂实施了最小TSV密度规则。该项目通过将空闲TSV重新配置为各种电路和系统的设备来应对这一挑战。为最大限度地利用TSV设备，还将提出一个机会主义的计算机辅助设计(CAD)框架。拟议中的研究将开创一个新的、变革性的方向，在所有设计级别--设备、电路和CAD--发展3D IC，而不需要改变目前的半导体工艺。PI还将利用与工业技术研究所的合作，为美国本科生和毕业生建立一个广泛的国际实习计划，这将使普通3D IC研究社区受益。此外，PI将在研究框架内为本科生和未被充分代表的少数族裔开发各种活动，为Rolla当地高中生举办全面的3D俄罗斯方块比赛，以及一个基于Web 2.0的3D论坛，用于3D IC社区的协作研究。

The three-dimensional integrated circuit (3D IC) stacks multiple dies in the vertical dimension using Through-Silicon-Vias (TSVs), which results in significantly reduced footprint, power and latency. While many challenges still exist related to 3D ICs, this project targets the one challenge that will become increasingly important in the next 5 to 10 years and may potentially end the production of 3D ICs: TSVs are quite large in size, yet their diameters do not scale with the devices due to the limitations of wafer handling and aspect ratios. On the other hand, a large number of TSVs are needed to deliver signal and power, to dissipate heat, and to provide redundancy. Moreover, foundries impose a minimum TSV density rule to maintain the planarity of the wafer during chemical and mechanical polishing (CMP). This project tackles the challenge by reconfiguring idle TSVs as devices for various circuits and systems. An opportunistic computer-aided design (CAD) framework will also be put forward for optimum utilization of the TSV devices. The proposed research will pioneer a new and transformative direction for the advancement of 3D ICs at all the design levels - devices, circuits and CAD - with no change required in current semiconductor processes. The PI will also leverage the collaboration with Industrial Technology Research Institute to set up an extensive international internship program for U.S. undergraduates and graduates, which will benefit the general 3D IC research community. In addition, the PI will develop various activities for undergraduates and underrepresented minorities within the research framework, full-filled 3D Tetris contests for Rolla local high school students, and a web 2.0-based 3D forum for collaborative research in the 3D IC community.