Implantable module-based microchip networks
Implantable module-based microchip networks
批准号:
401023906
负责人:
Professor Dr.-Ing. Maurits Ortmanns
金额:
$0.0万
依托单位国家:
德国
项目类别:
Research Grants
财政年份:
2018
资助国家:
德国
项目状态:
已结题
起止时间:
2017-12-31 至 2022-12-31
中文摘要
NeuroBus项目致力于实现由微型微芯片(µASIC)组成的植入式网络作为神经元接口。各种具有不同功能的伽马ASIC被设计成自给自足的模块,可以以不同的组合自由组合。各个模块被密封地封装并组装在聚酰亚胺上,以形成特定于应用的网络。该项目的目的是研究材料科学和电子基础,以提高新型植入物概念的生物稳定性和生物兼容性。ASIC的显著小型化、密封封装的体积减小以及在高度柔性的聚合物基板上的嵌入,使我们期望有更高的生物耐受性。不需要直流电压、不同元件之间适配的粘合促进剂以及ASIC直接用薄金属膜封装是该研究的进一步关键方面,以保持无与伦比的长期稳定性。开展的研究工作将找到方法来创造模块化和可扩展的植入物,这些植入物可以个性化,并形成大量其他模块的基础,从而在生物医学应用中应用。
英文摘要
The project NeuroBus deals with the realization of an implantable network of miniaturized microchips (µASICs) as neuronal interface. Various Gamma ASICs with different functions are designed as self-sufficient modules that can be freely combined in variable combinations. The individual modules are hermetically encapsulated and assembled on polyimide to form application-specific networks. The aim of the project is to study the material science and electronic fundamentals to achieve increased biostability and biocompatibility of the novel implant concept. A significant miniaturization of the ASICs, the volume reduction of the applied hermetic encapsulation and the embedding in a highly flexible polymer substrate lead us to expect a higher biological tolerability. The absence of DC voltage, the adapted adhesion promoters between the different components and the direct encapsulation of the ASICs with a thin metal film are further key aspects of the study in order to maintain an unequalled long-term stability. The conducted research work will find methods to create modular and scalable implants that can be personalized and which form the basis for a large number of other modules and thus applications in biomedical applications.
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