Development of high speed processing silicon slicer using diamond wire tool

金刚石线锯是对半导体材料和硬脆材料进行切割的一种方法。并且，该切片系统在不久的将来开始受到关注，用于改变多线锯使用浆料的方式。研究人员设计开发了新的金刚石绳锯切片系统和制丝系统。利用普通尺寸的金刚石钢丝刀具和新研制的小直径细钢丝刀具，研究了金刚石的切片特性和加工机理。作为线切割工具和切割机系统开发的成果，主要有以下几个方面：线切割工具的开发。调查人员利用直径为30-40μm的金刚石颗粒和缠绕的芯线(两根直径为58μm的钢琴钢丝)，成功地研制出了直径为180μm的细金刚石绳索工具。该细金刚石丝刀具的加工效率是普通尺寸金刚石丝刀具的1.3倍。根据材料强度和扭度试验的结果，该金刚石细丝工具的加工钢丝张力必须设定在7.84N或更小的值。在切片时旋转工件的加工效率是普通切片的两倍(在不旋转工件的情况下)。并且，旋转切割降低了表面粗糙度。通过异步化设定走丝和工件旋转的反向时间，可以减小锯痕。研究人员开发了一种新型的细绳工具切割机，使细绳工具能够以200m/min的走丝速度运行。

The diamond wire saw is one of slicing methods to semiconductor materials and hard and brittle materials. And, this slicing system is begun to paid attention for near future slicer to change the multi-wire saw using slurry. The investigators designed to develop the new slicing systems and wire making system of the diamond wire saw. The slicing characteristics and the processing mechanisms were studied by using the normal size diamond wire tool and the newly developed thin wire tool with a small diameter. As the results of development of wire tool and slicer system, the followings are clear;◎ Development of wire tool1. The investigators made success of the thin diamond wire tool of the diameter of 180 μm by using the diamond grains of 30-40 μm and the twisting core wire (two piano wires of the diameter of 58 μm).2. This thin diamond wire tool showed 1.3 times as much as the processing efficiency compared with the ordinary size diamond wire tool.3. As the results of material strength and twist test, the processing wire tension of this thin diamond wire tool had to set on the value of 7,84 N or less.◎ Development of slicing system1. The processing efficiency by means of rotating the workpiece in the slicing was twice as much as the normal slicing (in case of no-rotating workpiece). And, the slicing by rotating the workpiece decreased the surface roughness.2. The saw mark could decrease by setting up asynchronously the reverse time of wire running and workpiece rotating.3. The investigators developed the new slicer for thin wire tool, and the thin wire tool became to be able to run at 200m/min as the wire running speed.