Development of ID-blade saw using elliptical vibration

ID锯片是对半导体材料和硬脆材料进行切片的一种方法。本课题设计开发了一种新型锯片切片系统，并利用含碳化硅颗粒的工作液对锯片的切片特性和加工机理进行了研究。结果表明：1.切片是将碳化硅颗粒像工作液一样混合在水中。实验结果表明，添加防蒸发和防沉降剂的多绳锯专用工作液的切片性能优于水或普通切削油。碳化硅颗粒具有较高的破碎特性，适合作为工作液中的混合磨料颗粒。当碳化硅颗粒直径与金刚石颗粒在刀具上的平均投影长度相同时，刃口切削量最小。刃口切屑的长度取决于刀具和工件之间的切入和切出角度。切入侧的切屑长度小于切出侧的切屑长度。当切入和切出角度变小时，切边长度表现为较小的值。并且，振动处理后的切屑长度明显大于非振动处理。加入含碳化硅颗粒的工作液后，晶片的波纹度和弯曲度变小。并且，晶片的表面粗糙度变大。晶片表面的损伤层为30μm.5。含有碳化硅颗粒的工作液使刀具的磨损量增大。

The ID-blade saw is one of slicing method to semiconductor materials and hard and brittle materials. The investigator designed to develop the new slicing system of ID-blade saw and studied on slicing characteristics and processing mechanisms by using the working fluid with SiC grains. As the results, the followihgs are clear;1. The slicing was practiced to mix the SiC grains in the water like working fluid. As the experimental results, The exclusive working fluid for multi-wire saw that add the prevention of evaporation and settlement showed better slicing characteristics than water or normal cutting oil.2. The SiC grains were good for mixed abrasive grains in the working fluid because these grains have high breaking characteristic. When the diameter of the SiC grains was same to mean projection length of diamond grains on the tool, the edge chipping showed smallest value.3. The length of edge chipping changed to depend on cut-in and cut-out angles between tool and workpiece. The chipping length at the cut-in side was smaller than one at the cut-out side. When cut-in and the cut-out angles became small, the length of edge chipping showed small value. And, it was clear that the length of chipping by vibration processing became larger than non-vibration cutting.4. The waviness and BOW of wafers became small by the working fluid with SiC grains. And, the surface roughness of wafers became large. The damage layer on wafer surface was 30μm.5. The wear volume of tool became large by the working fluid with SiC grains.