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Study on Recovering Techniques of Deteriorated Lapping Plate Used Correcting Carrier

修正载体磨损研磨板修复技术研究

基本信息

批准号：
02650103
负责人：
ISHIKAWA Ken-ichi
金额：
$ 0.96万
依托单位：
Kanazawa Institute of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for General Scientific Research (C)
财政年份：
1990
资助国家：
日本
起止时间：
1990 至 1991
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-02650103/
关键词：
Abrasive Grains Lapping Grooved Laping Plate Correct Processing Profile Surface Roughness Vibration Correcting Carrier

项目摘要

This study deals with the theoretical analysis and experimental investigations for recovering characteristics of the deteriorated lapping plate used the correcting carrier. When the wear characteristics of the lapping plate is theoretically analyzed on a few assumptions in this report, it is practicable to surmise the best recovering characteristics of the deteriorated lapping plate. As the results, the following becomes clear.1. The wear characteristics on theoretical analysis considered the lapping distance and lapping pressure agree with the experimental results.2. The processing pressure during lapping changes according to the wear shapes of the lapping plate surface. Therefore, when the processing pressure is corrected with change of surface shapes, theoretical results of the lapping plate and correcting carrier can surmise wear characteristics measured through the experiments.3. The profiles of the lapping plate and correcting carrier are decided at wear times of some extent. And after that, it is clear that wear volume only decreases while surface profile keeps decided shapes in the initial stage.4. In case of lapping machine of small type used at this experiment, wear characteristics of the lapping plate aren't effected by grooves cut on the 1-apping plate.5. The theory in this study can surmise the best correcting condition of correcting process.6. When the correcting carrier of rectangle type is used, the flat surface of lapping plate keeps the initial shape during lapping process.7. The correcting carrier of rectangle type is able to be used for the the correcting process of deteriorated lapping plate.

本文从理论上分析和实验上研究了用修正载体恢复研磨盘的特性。本文通过对研磨盘磨损特性的理论分析，在一定的假设条件下，得出了研磨盘磨损后的最佳恢复特性。作为结果，以下变得清晰。1.理论分析中考虑研磨距离和研磨压力时的磨损特性与实验结果相吻合.研磨过程中的加工压力根据研磨板表面的磨损形状而变化。因此，当加工压力随表面形状的变化而修正时，研磨盘和修正载体的理论计算结果可以与实验测量的磨损特性相吻合.研磨盘和校正架的轮廓在一定程度上取决于磨损次数。在此之后，很明显，磨损体积只减少，而表面轮廓保持在初始阶段的确定形状.在本实验所用的小型研磨机中，研磨盘上的沟槽不影响研磨盘的磨损特性。本研究的理论可以推测矫正过程的最佳矫正条件。采用矩形校正载体时，研磨过程中研磨板的平面保持初始形状.矩形型校正架可用于研磨板损坏的校正过程。