A Study on High Accuracy of OD-bade Saw (Micro-Cutting by Vibration)
A Study on High Accuracy of OD-bade Saw (Micro-Cutting by Vibration)
批准号:
06650152
负责人:
ISHIKAWA Ken-ichi
金额:
$0.83万
依托单位国家:
日本
项目类别:
Grant-in-Aid for General Scientific Research (C)
财政年份:
1994
资助国家:
日本
项目状态:
已结题
起止时间:
1994 至 1995
中文摘要
点击翻译按钮获取中文摘要
英文摘要
The main results of this study by GRANT-IN AID FOR SCIENTIFIC RESEARCH (c) are as follows.1. Vibration cutting using OD-blade of continuous type (Applied vibration is cutting direction)(1) When frequency and amplitude are increased, the cutting load is decreased gradually. In the best condition of vibration cutting, the cutting load in vibration becomes one-thirds of load in nonvibration cutting.(2) In the vibration cutting, cutting width of work is increased a little, but waviness of cutting surface and chipping is decreased.2. Vibration cutting using OD-blade of segment type (Applied vibration is cutting direction)(1) As vibration cutting is intermittent cutting, working fluid tends to enter in cutting aria by separation between tool and work during one vibration cycle. And in the time of contact, the vibration phenomena tends to remove the chip. Therefore, this cutting method is good for defend of glazing.(2) In the vibration cutting, cutting width of work is increased a little, but waviness of cutting surface and chipping is decreased.3. Vibration cutting using OD-blade of continuous type (Applied vibration is vertical direction)(1) When amplitude are increased, the cutting load is decreased gradually. In the best condition of vibration cutting, the cutting load in vibration becomes half of load in nonvibration cutting.(2) When amplitude are increased, the wear for radius of OD-blade is increased a little. And, the wear for blade width is decreased.
期刊论文(4)
专著(0)
科研奖励(0)
会议论文
Ken-ichi ISHIKAWA: "A Study on Vibration Cutting Characteristics Using OD-blade" JOURNAL of the Japan Society for Precision Engineering. 62-3. 438-442 (1996)
Ken-ichi ISHIKAWA:“使用 OD 刀片进行振动切削特性的研究”日本精密工程学会期刊。
DOI:
--
发表时间:
期刊:
影响因子:
--
作者:
[]
通讯作者:
石川憲一: "振動を利用した外周刃切断の加工特性に関する研究" 精密工学会誌. 62. 438-442 (1996)
Kenichi Ishikawa:“利用振动进行周边刀片切削加工特性的研究”日本精密工程学会杂志 62. 438-442 (1996)。
DOI:
--
发表时间:
期刊:
影响因子:
--
作者:
[]
通讯作者:
Proposal and its verification of novel evaluation/ design method of Japanese sword based on scientific elucidation for beauty
-
批准号:17K06129
-
项目类别:Grant-in-Aid for Scientific Research (C)
-
资助金额:$3.0万
-
财政年份:2017
-
负责人:ISHIKAWA Ken-ichi
-
依托单位:
Development of vibratory OD-blade slicing method with high efficiency and long tool life for composite materials
-
批准号:20560116
-
项目类别:Grant-in-Aid for Scientific Research (C)
-
资助金额:$2.66万
-
财政年份:2008
-
负责人:ISHIKAWA Ken-ichi
-
依托单位:
Development of High Accuracy Process Technique in 4-way System Diamond Pellets Grinding
-
批准号:18560116
-
项目类别:Grant-in-Aid for Scientific Research (C)
-
资助金额:$2.08万
-
财政年份:2006
-
负责人:ISHIKAWA Ken-ichi
-
依托单位:
Relationship Between Slurry Actions in Slicing Grooves and Slicing Characteristics at Multi-Wire Saw to slice semiconductor materials
-
批准号:15560104
-
项目类别:Grant-in-Aid for Scientific Research (C)
-
资助金额:$2.05万
-
财政年份:2003
-
负责人:ISHIKAWA Ken-ichi
-
依托单位:
Development of ID-blade saw using elliptical vibration
-
批准号:12650128
-
项目类别:Grant-in-Aid for Scientific Research (C)
-
资助金额:$2.18万
-
财政年份:2000
-
负责人:ISHIKAWA Ken-ichi
-
依托单位:
Development of high speed processing silicon slicer using diamond wire tool
-
批准号:11555046
-
项目类别:Grant-in-Aid for Scientific Research (B)
-
资助金额:$5.25万
-
财政年份:1999
-
负责人:ISHIKAWA Ken-ichi
-
依托单位:
Study on development of electrodeposited diamond wire tool which ensures high machining efficiency and longer life of tool
-
批准号:08650157
-
项目类别:Grant-in-Aid for Scientific Research (C)
-
资助金额:$1.02万
-
财政年份:1996
-
负责人:ISHIKAWA Ken-ichi
-
依托单位:
Study on Recovering Techniques of Deteriorated Lapping Plate Used Correcting Carrier
-
批准号:02650103
-
项目类别:Grant-in-Aid for General Scientific Research (C)
-
资助金额:$0.96万
-
财政年份:1990
-
负责人:ISHIKAWA Ken-ichi
-
依托单位:
Study on High Efficiency Sliceing for Hard and Brittle Materials
-
批准号:63550111
-
项目类别:Grant-in-Aid for General Scientific Research (C)
-
资助金额:$1.15万
-
财政年份:1988
-
负责人:ISHIKAWA Ken-ichi
-
依托单位:
海外基金