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Study on High Efficiency Sliceing for Hard and Brittle Materials

硬脆材料高效切片研究

基本信息

批准号：
63550111
负责人：
ISHIKAWA Ken-ichi
金额：
$ 1.15万
依托单位：
KANAZAWA INSTITUTE OF TECHNOLOGY
依托单位国家：
日本
项目类别：
Grant-in-Aid for General Scientific Research (C)
财政年份：
1988
资助国家：
日本
起止时间：
1988 至 1989
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-63550111/
关键词：
Abrasive Grains Diamond Grains Vibration Multiwire Sawing Hard and Brittle Material High Efficiency High Accuracy ラッピング加工マルチワイヤソー加工クラック層

项目摘要

We studied on high efficiency sliceing for hard and brittle materials in two years. As the results, the following becomes clear.1. In the vibration sliceing, when frequency of the wire << natural frequency of the wire, movement of the wire becomes linear.2. The machining efficiency in the vibration slicing is an increase of 2 times compared with the non- vibration slicing by entrance of effective abrasive grains and an increase of effective slicing load.3. The interdependence between machining efficiency in the vibration slicing and phase angle of vibrations of both sides in processing part is little.4. Thickness of wafers after slicing shows such a tendency that the thickness in the vibration slicing is little more thin than the thickness in the nonvibration slicing. And, depression of the thickness decreases as the vibration amplitude increases.5. Waviness of wafers after slicing shows tendency that waviness in the longitudinal direction increases slightly as the amplitude increases and the waviness in the slicing direction decreases as the amplitude increases.6. Processing crack layer of silicone wafer in the vibration slicing shows the same value ( 6-9 mum) as it in the nonvibration slicing.7. The apparatus to grind spiral grooves on surface of wire tool is designed and made as an experiment, and tensile stress of the spiral grooved wire tool is measured. As the results, tensile stress of the spiral grooved wire shows a decrease from 80 % to 90 % compared with the ordinary wire.8. When the spiral grooved wire is used, the machining efficiency increases as pitch of the spiral grooves decreases. And when pitch of the spiral grooves is 2 am, the machining efficiency in the vibration slicing is a increase of 4 times compared with the ordinary wire used in the nonvibration slicing.

经过两年的努力，我们研究了硬脆材料的高效切片技术。作为结果，以下变得清晰。1.在振动切片中，当金属丝的频率<<金属丝的固有频率时，金属丝的运动变为线性.通过有效磨粒的进入和有效切削载荷的增加，振动切削的加工效率比非振动切削提高了2倍.振动切片的加工效率与被加工零件两侧振动的相位角之间的相关性不大.切片后的晶片厚度显示出这样的趋势，即振动切片中的厚度比非振动切片中的厚度薄一些。并且，随着振动幅度的增大，厚度的降低减小.切片后硅片的波纹度呈现出纵向波纹度随振幅增大而略有增大，切片方向波纹度随振幅增大而减小的趋势.在振动切片中的硅晶片的加工裂纹层显示与在非振动切片中相同的值（6-9 μ m）.设计并制作了线切割工具表面螺旋槽磨削装置，进行了螺旋槽线切割工具的拉应力测试。结果表明，螺旋槽钢丝的拉应力比普通钢丝降低了80%~ 90%.当使用螺旋槽线时，加工效率随着螺旋槽的节距减小而增加。当螺旋槽的螺距为2 μ m时，振动切片的加工效率比普通钢丝在非振动切片中的加工效率提高了4倍。