Study on High Efficiency Sliceing for Hard and Brittle Materials

我们用两年的时间研究了硬脆材料的高效切片。作为结果，以下几点变得清晰起来。在振动切片中，当线材的频率<<线材的固有频率时，线材的运动成线性。2 .由于有效磨粒的进入和有效切片载荷的增加，振动切片的加工效率比非振动切片提高了2倍。振动切片的加工效率与加工零件两侧振动相位角的相关性很小。切片后的晶片厚度呈现出这样的趋势，即振动切片时的厚度比非振动切片时的厚度略薄。随着振动幅值的增大，厚度的凹陷减小。切片后的晶圆波纹度呈现纵向波纹度随振幅增加而略有增加，切片方向波纹度随振幅增加而减小的趋势。振动切片时硅片的加工裂纹层值与非振动切片时相同（6-9 μ m）。设计并制作了线刀表面螺旋槽磨削装置，并对螺旋槽线刀的拉应力进行了测量。结果表明，螺旋槽线材的拉伸应力比普通线材降低80% ~ 90%。采用螺旋槽线材时，螺旋槽节距越小，加工效率越高。当螺旋槽节距为2am时，振动切片的加工效率比非振动切片中使用的普通线材提高了4倍。

We studied on high efficiency sliceing for hard and brittle materials in two years. As the results, the following becomes clear.1. In the vibration sliceing, when frequency of the wire << natural frequency of the wire, movement of the wire becomes linear.2. The machining efficiency in the vibration slicing is an increase of 2 times compared with the non- vibration slicing by entrance of effective abrasive grains and an increase of effective slicing load.3. The interdependence between machining efficiency in the vibration slicing and phase angle of vibrations of both sides in processing part is little.4. Thickness of wafers after slicing shows such a tendency that the thickness in the vibration slicing is little more thin than the thickness in the nonvibration slicing. And, depression of the thickness decreases as the vibration amplitude increases.5. Waviness of wafers after slicing shows tendency that waviness in the longitudinal direction increases slightly as the amplitude increases and the waviness in the slicing direction decreases as the amplitude increases.6. Processing crack layer of silicone wafer in the vibration slicing shows the same value ( 6-9 mum) as it in the nonvibration slicing.7. The apparatus to grind spiral grooves on surface of wire tool is designed and made as an experiment, and tensile stress of the spiral grooved wire tool is measured. As the results, tensile stress of the spiral grooved wire shows a decrease from 80 % to 90 % compared with the ordinary wire.8. When the spiral grooved wire is used, the machining efficiency increases as pitch of the spiral grooves decreases. And when pitch of the spiral grooves is 2 am, the machining efficiency in the vibration slicing is a increase of 4 times compared with the ordinary wire used in the nonvibration slicing.