Active emitting 3D Photonic Crystals prepared by direct wafer bonding

周期性介电结构具有影响其边界内的电磁态密度并部分或完全抑制频率范围内的所有模式的能力。在拟议的项目中，我们将生产三维光子晶体相结合的深紫外光刻，电子束写入技术和直接晶片键合制备所谓的木桩结构使用高介电对比度的Si/空气结构。通过这种方式，我们将设计一种结构，在所有三个方向上都具有完整的带隙，以实现所需的1.54 µm波长。基于单晶硅的线结构将使用反应等离子体蚀刻来制备。然后，这些结构将使用直接晶片键合的方法以交叉取向面对面键合。之后，Si衬底将被移除，留下亚微米网格结构未被触及。以这种方式，三维结构将逐层发展。设计了缺陷和有源发射源，以验证该结构的有源和无源波导特性。将通过光谱方法进行结构的光学表征。部分这将通过光子晶体计划中建立的可能性来实现。

Periodic dielectric structures have the ability to affect the density of electro-magnetic states within their boundaries and suppress all modes for a range of frequencies partially or completely. In the proposed project we will produce 3-dimensional photonic crystals by combining deep UV lithography, electron beam writing techniques and direct wafer bonding for preparation of so-called wood pile structures using the high dielectric contrast of a Si/air structure. In this way, we will design a structure with a complete band gap in all three directions for the desired wavelength of 1.54 µm. Line structures based on single crystalline Si will be prepared using reactive plasma etching. Then, these structures will be face to face bonded in cross orientation using the method of direct wafer bonding. Afterwards, the Si substrate will be removed leaving the sub micrometer grid structure untouched. In this way the three dimensional structure will be developed layer by layer. The implementation of defects as well as active emitting sources are planed to demonstrate the active and passive waveguide properties of the structure. The optical characterization of the structures will be done by spectroscopic methods. Partly this will be realized using the possibilities established in the Photonic Crystal program.