Integrated Reliability Evaluation and Design for Advanced 3D Electronics Packaging

据预测，由于高速信号传输的高频领域的需要，包括3D封装在内的高密度封装将成为主要的表面贴装技术。在3D封装技术中，需要一种将半导体设计、基板设计和设备设计相结合的集成设计。此外，为了在技术竞争中占据主导地位，有必要通过在早期设计阶段完成设计来缩短开发时间。此外，由于与铅相关的环境问题，现在制定去除铅的法规和使用无铅焊料取代锡铅焊料的运动正在迅速发展。在这种新的3D封装技术和设计理念下，可靠性评估和设计技术的建立是非常重要的因素。本文采用分析和实验的方法，对无铅焊料在实际应用之前必须解决的可靠性评估和设计问题进行了研究。通过这项研究，揭示了无铅焊料在实际应用中的可靠性评估和设计问题，并提出了解决这些问题的方法。通过这项研究，可以提高无铅焊点的可靠性和可靠性评估的效率，并通过缩短设计周期来降低生产成本。

It is forecast that high-density packaging, including 3D packaging, will become a main surface mount technology because of a need in the high-frequency areas of high-speed signal transmission. In the 3D packaging technology, an integrated design that unites the technology of semiconductor design, substrate design and equipment design is necessary. In addition, it is necessary to shorten the development time by completing the design at an early design stage in order to dominate technological competition. Additionally, due to the environmental problems associated with lead, the movement to establish regulations for the removal of lead and the use of lead-free solder material to replace Sn-Pb solder are growing rapidly now. With such new 3D packaging technology and design concepts, the reliability assessment and establishment of design techniques are very important factors.In this paper, reliability assessment and design problems, which must be solved before lead-free solder can be used in practical applications, are examined using analytical and experimental methods. Through this study, reliability assessment and design problems, which have become very important in practical applications of lead-free solder, are shown, and solutions for these problems are proposed. As a result of this study, it is possible to improve the reliability of lead-free solder joints and the efficiency of reliability assessments as well as to reduce production costs by shortening the design period.