Metal plating of Fiber and polymer materials using Super Critical Carbon dioxide

为了利用有机纤维和有机板材制备一些新型的导线和器件，具有非常轻但性能非常强的特性，人们尝试使用超临界二氧化碳进行了研究。为了提高金属镀膜在纤维和板材上的附着力，选择了合适的有机金属络合物作为电镀催化剂。首先通过测量纤维和板材上的溶解度和亲和力，研究了每一种纯络合物和络合物混合物的行为。采用复合浸渍后再进行高温处理的方法可以获得足够高的镀铜量，对液晶聚合物液晶聚合物和环氧板进行了特殊处理，其中一种是采用复合混合物浸渍，另一种是在超临界二氧化碳复合浸渍前采用电子束、等离子体和激光辐照。

In order to prepare some new types of electro conductive wires and devices using organic fibers and plates having very light, but very strong properties an attempt has been investigated applying supercritical carbon dioxide. To improve the adhesion properties of metal plating on the fibers and plates, suitable organic metal complexes were selected as catalyst for plating. The behaviors of each pure complex and the complex mixtures were first investigated by measuring the solubility and affinity on the fiber and plate materials. Enough high Cu plating has been done by using complex mixtures and treating at higher temperature after complex impregnation.Some special treatments have been done for liquid crystal polymer LCP and epoxy polymer plate ; one of them the impregnation of complex mixtures and the other one is application of electron beam, plasma and laser irradiation before complex impregnation using supercritical carbon dioxide.