Laser dicing of thick and brittle wafers: Lithium Niobate case

该项目将寻求开发一种创新的、首创的激光加工解决方案，用于在单层或多层排列中切割（切割）厚而脆的晶圆，这是针对半导体制造行业的。该项目预计将带来的商业效益是消除与目前使用的刀片切割相关的切屑、分层和开裂。在这个项目中，我们将使用铌酸锂（LiNbO3）晶圆来开发我们提出的激光加工技术。LiNbO3晶圆广泛应用于高科技光子、压电和电光器件中。这个项目是由先进有限公司，总部设在英国。Advancete是一家创业公司，拥有6年的成功贸易记录，专业从事激光加工技术，用于电子，航空航天，能源等广泛行业的先进制造应用。

This project will seek to develop an innovative and first-of-a-kind laser processing solution for dicing (cutting through) thick and brittle wafers in single-layer or multi-layer arrangements, which is targeted towards the semiconductor fabrication industry. The commercial benefits expected to arise from the project are elimination of chipping, delamination and cracking associated with currently used blade dicing. In this project we will use Lithium Niobate (LiNbO3) wafers for the development of our proposed laser processing technique. LiNbO3 wafers are used extensively in high-tech photonic, piezoelectric, and electro-optic devices.This project is being led by Advancete limited, a UK based company. Advancete is a start-up with a successful trading record of 6 years with expertise in laser processing techniques for advanced manufacturing applications in a wide range of industries such as Electronics, Aerospace, Energy, etc.