Quantum Technology Capital: Quantum Photonic Integrated Circuits (QuPIC)

我们将建立英国量子器件原型服务，专注于量子光子器件的设计、制造、测试、封装和快速器件原型。QuPIC将为学术界和工业界提供一条经济实惠的途径，通过商业级制造代工厂和支持基础设施来制造量子光子器件。QuPIC将为每个代工厂的制造工艺、多项目晶圆访问、测试和测量以及系统集成设施提供量身定制的合格设计工具，沿着器件原型制作能力。其目的是通过允许量子光子技术的采用者实现先进的集成量子光子器件，并在不需要深入知识的情况下实现更大的能力。我们将汇集一支经验丰富的工程师和科学家团队，提供所需的广泛专业知识，以支持和提供这项服务。四个工作包提供QuPIC服务。它们是：WP 1-用于光子模拟和设计软件、热和机械设计包和建模的设计工具WP 2-晶圆制造-为不同的制造工艺和材料建立合格的组件库，并为用户提供多项目晶圆服务WP 3-集成器件测试和测量-支持单光子探测器集成的自动化晶圆级电气和光学表征、对准系统、低温系统）WP 4-封装和原型制作-用于子系统集成到混合和功能化量子光子系统中的工具，以及用于新型、半导体和半导体器件的快速原型制作。晶圆级制造和测试之前的候选组件设计设计工具（WP 1）将提供所有核心功能和组件库，以允许用户为一系列应用设计量子电路。我们将与晶圆代工厂（WP 2）密切合作，以鉴定设计库，并通过多项目晶圆方法提供负担得起的高质量器件，其中许多用户分担制造成本。专业测试和测量设施（WP 3）将提供快速的器件表征（在晶圆级），而封装和原型工具（WP 4）将允许将子系统组装成高度功能化的量子光子系统。

We will establish a UK quantum device prototyping service, focusing on design, manufacture, test, packaging and rapid device prototyping of quantum photonic devices. QuPIC will provide academia and industry with an affordable route to quantum photonic device fabrication through commercial-grade fabrication foundries and access to supporting infrastructure. QuPIC will provide qualified design tools tailored to each foundry's fabrication processes, multiproject wafer access, test and measurement, and systems integration facilities, along with device prototyping capabilities. The aim is to enable greater capability amongst quantum technology orientated users by allowing adopters of quantum photonic technologies to realise advanced integrated quantum photonic devices, and to do so without requiring in-depth knowledge. We will bring together an experienced team of engineers and scientists to provide the required breadth of expertise to support and deliver this service.Four work packages deliver the QuPIC service. They are:WP1 - Design tools for photonic simulation and design software, thermal and mechanical design packages and modellingWP2 - Wafer fabrication - Establishing the qualified component library for the different fabrication processes and materials and offering users a multi-project wafer serviceWP3 - Integrated device test and measurement - Automated wafer scale electrical and optical characterisation, alignment systems, cryogenic systems to support single-photon detector integration)WP4 - Packaging and prototyping - Tools for subsystem integration into hybrid and functionalised quantum photonic systems and the rapid prototyping of novel, candidate component designs before wafer-scale manufacturing and testingThe design tools (WP1) will provide all the core functionality and component libraries to allow users to design quantum circuits, for a range of applications. We will work closely with fabrication foundries (WP2) to qualify the design libraries and to provide affordable access to high-quality devices via a multi-project wafer approach, where many users share the fabrications costs. Specialist test and measurement facilities (WP3) will provide rapid device characterization (at the wafer level), whilst packaging and prototyping tools (WP4) will allow the assembly of subsystems into highly functionalised quantum photonic systems.