Market assessment: surface plasmonic optoelectronic devices on silicon

本市场评估将展示非接触式光学探测技术对改善微电子芯片制造的影响。在为移动设备等产品提供更便宜、更强大的芯片的驱动下，传统的测试方法在满足市场需求方面受到了重大挑战。拟议的项目探索使用非接触式光学探测作为半导体行业晶圆级功能测试的传统方法的辅助手段，以克服行业面临的重大挑战。市场评估工作将收集和比较目前的数据，这些数据从目前和未来对半导体工业的成本影响的角度说明所处理问题的性质，以期通过一家新的开办公司使这项技术商业化。行业报告不仅对当前的挑战达成了共识，而且还预测了这些挑战将如何随着技术的发展而演变，这些技术将用于帮助确定我们提出的解决方案。评估还将利用对学术界和工业界的用户和研究人员的调查，在某些情况下通过商业报告。该技术的早期可行性数据将与选定的行业参与者分享，以获得他们对部署的反馈。

This market assessment will demonstrate the impact of a non-contact optical probing technology on improving microelectronic chip manufacturing. In the drive for cheaper, more powerful chips for products such as mobile devices, traditional test methods are significantly challenged in meeting the needs of the market. The proposed project explores the use of non-contact optical probing as an adjunct to conventional methods of wafer-level functional testing in the semiconductor industry in order to overcome the significant challenges facing the industry. The market assessment exercise will gather and compare current data that situates the nature of the problem addressed in terms of its present and future cost impact to the semiconductor industry, with a view to commercializing the technology through a new start-up company. Industry reports that not only capture a consensus of current challenges, but also forecast how these will evolve as technology develops will be used to help situate our proposed solution. The assessment will also draw on surveys of users and researchers in academia and industry, in some cases through commercial reports. Early feasibility data on the technology will be shared with selected industry players in the process of getting their feedback with respect to deployment.