3D Ceramic Sensors and Circuits

在过去的25年里，技术的进步极大地影响了社会的各个方面。因此，信息技术、医疗设备和消费产品，如手机、计算机、录像机、汽车零部件等，严重依赖于微系统技术（即微电子、光子学、无线电路和传感器）。未来的产品将希望系统更紧凑、多用途、功能更强大、更便宜。为了实现这一目标，需要更高的工作频率和更宽的带宽。这项研究将集中在高速电子产品上，利用先进的低温陶瓷来创造更高水平的集成度和功能性。我们已经开发出一种独特的低温陶瓷工艺，用于在集成电路（ic）和印刷电路板（pcb）上沉积薄膜，厚膜和3d陶瓷。大多数陶瓷必须在1000摄氏度左右或更高的温度下制造。这会破坏集成电路。我们可以在150摄氏度的温度下进行，并保持集成电路的完整性。没有人能做到这一点。这将影响可调谐电子，微型电子天线和滤波器与适当掩蔽方法的发展。我们率先将3-D陶瓷集成到ic和pcb上，减少了产品尺寸和成本，并增加了功能。我们将在我们新颖的低温工艺中研究磁性陶瓷材料。这将允许超出标准规范的电子应用，因为这些材料可以沉积到集成电路和pcb上。拟议的研究将有助于加拿大工业生产和制造更小、更多功能和更便宜的产品。这将在医疗传感器、汽车雷达、毫米无线局域网（如未来的5G手机）和医疗诊断设备等领域提供巨大的全球竞争优势。

Advances in technology have greatly influenced all aspects of society in the last twenty-five years. As a result, information technology, medical equipment and consumer products such as cellphones, computers, video recorders, automotive parts, etc. rely heavily on microsystems technology (i.e. microelectronics, photonics, wireless circuits and sensors). Future products will desire systems that are more compact, versatile, functional and less expensive. To achieve this, higher operating frequencies and wider bandwidths become necessary. This research will focus on high speed electronics to create a higher level of integration and functionality using advanced low temperature ceramics. We have developed a unique low temperature ceramic process for depositing thin film, thick film and 3-D ceramics onto integrated circuits (ICs) and printed circuit boards (PCBs). Most ceramics have to be made at around 1000 degrees Celsius or more. This destroys the IC. We can do it at 150 degrees Celsius and maintain the integrity of the IC. No one else has achieved this. This will impact tunable electronics, miniature electronic antennae and filters with the development of appropriate masking methods. We were the first to integrate 3-D ceramics onto ICs and PCBs, reducing product size and cost, and increasing functionality. We will investigate magnetic ceramic materials in our novel low temperature process. This will allow applications to electronics beyond the standard norm because these materials could then be deposited onto ICs and PCBs. The proposed research will assist the Canadian industry in producing and manufacturing smaller, more versatile and less expensive products. This will provide a substantial competitive advantage globally in medical sensors, automotive radar, millimeter wireless LAN like the future 5G phone and medical diagnostics equipment.