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Design of high precision MEMS gyroscope compatible with wafer level packaging process (Micralyne "MicraSilQ")

Design of high precision MEMS gyroscope compatible with wafer level packaging process (Micralyne "MicraSilQ")
兼容晶圆级封装工艺的高精度MEMS陀螺仪设计(Micralyne“MicraSilQ”)
批准号:
531949-2018
负责人:
Ahamed, Mohammed
金额:
$1.82万
依托单位:
依托单位国家:
加拿大
项目类别:
Engage Grants Program
财政年份:
2018
资助国家:
加拿大
项目状态:
已结题
起止时间:
2018-01-01 至 2019-12-31

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中文摘要
翻译
陀螺仪是一种传感器,可以测量物体的旋转速度。基于MEMS(微电子机械**系统)的陀螺仪是使用基于半导体的**微细加工制造的微型传感器。MEMS陀螺仪具有许多优点,包括体积更小、重量更轻、成本更低、激励功率更低。MEMS陀螺仪使用一个小的振动质量作为核心传感元件,对角运动做出反应。振荡质量需要在真空下振动,以**最大限度地提高其灵敏度,并最大限度地减少漂移。真空隔离是必要的,以:(I)最大限度地减少空气阻尼造成的振动**能量损失,以及(Ii)保持易碎机械部件的完整性,使其免受灰尘或**污染。有多种真空封装方法可供选择,包括逐个芯片**基片封装和晶片级封装。单个器件的真空封装成本很高,而且无法提供**大规模生产,因此晶片规模的封装是首选。最近,Micralyne开发了晶圆规模**真空封装方法(MicraSilQTM)平台,该平台提供了集成晶圆级**制造和密封真空封装的一体化解决方案。对于需要**高精度、低噪音机械传感进行加速度和冲击测量的应用而言,它是一种经过验证的、经济高效的解决方案。使用这一工艺,**Micralyne展示了高性能的加速度计。然而,该平台也是MEMS**陀螺仪的理想选择。Micralyne有兴趣开发一种与MicraSilQ兼容的陀螺仪设计。目前,还没有适用于MicraSilQ的高精度陀螺仪的MEMS陀螺仪设计方法。这笔Engage赠款将通过使用**分析和数值建模技术为MicraSilQ平台开发MEMS陀螺仪设计。在航空航天、消费电子、生物医学、国防和自主应用中,对高精度MEMS陀螺仪的需求非常大。此次NSERC项目**将是Micralyne Inc.与温莎大学的Jalal Amed博士**合作开发与晶片规模真空封装的MicraSilQ平台兼容的MEMS陀螺仪。
英文摘要
A gyroscope is a sensor that can measure the rate of rotation of an object. MEMS (Microelectromechanical**Systems) based gyroscopes are miniature sensors that are fabricated using semiconductor based**microfabrication. MEMS gyroscopes offer a wide range of advantages, including smaller size, lighter weight,**lower cost, and lower excitation power. MEMS gyroscopes use a small oscillating mass as the core sensing**element that responses to angular motion. The oscillating mass needs to be vibrating under vacuum to**maximize its sensitivity and minimize drift. The vacuum isolation is necessary to: (i) minimize vibration**energy loss due to air damping and (ii) maintain integrity of the fragile mechanical component from dust or**contamination. Various vacuum packaging methods are available including sealing individual chip by chip**basis and wafer-level sealing. Individual device per device vacuum packaging is costly and fails to provide**mass manufacturing therefore wafer-scale packaging is preferred. Recently, Micralyne developed a wafer-scale**vacuum packaging method (MicraSilQTM) platform that offers an all-in-one solution integrating wafer-level**fabrication and hermetic vacuum packaging. It is a proven, cost-effective solution for applications requiring**high accuracy, low-noise mechanical sensing for acceleration and shock measurements. Using this process,**Micralyne showed high performance accelerometers. However, this platform is also ideal for MEMS**gyroscopes. Micralyne is interested to develop a gyroscope design compatible with MicraSilQ. Currently, there**is no MEMS gyroscope design approach available that can be suitable with MicraSilQ for high precision**gyroscopes. This Engage grant will develop a MEMS gyroscope design for MicraSilQ platform by using**analytical and numerical modelling techniques. There is a huge demand for high precision MEMS gyroscopes**in aerospace, consumer electronics, biomedical, defense, and autonomous applications. This NSERC Engage**will be the first collaborative effort between Micralyne Inc. and Dr. Jalal Ahamed of University of Windsor to**develop MEMS gyroscopes compatible with the wafer-scale vacuum packaged MicraSilQ platform.
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