Knowledge-based approach to electromagnetic parametric modeling and optimization of high-speed electronic packages

该项目解决了设计高速电子封装的挑战，这些封装是下一代网络(如5G无线网络和物联网网络)的基本构建块。随着下一代网络对电子设备和封装中信号速度的要求不断提高，电子封装中的电磁效应变得非常明显。基于电磁的设计和优化成为必要。近二十年来的重大研究进展使电磁仿真在高速/高频电子设计的分析和验证中得到了广泛的应用。然而，由于需要在物理/几何参数重复变化的情况下进行高度重复性的电磁模拟，因此电磁优化仍然具有挑战性且计算代价高昂。这项研究解决了这些挑战，并为高速封装的电磁参数建模和优化开发了新的方法。参数模型将允许根据物理/几何变量的变化快速评估电磁行为。优化算法将自动调整物理/几何参数，以实现高速封装的最佳电磁行为。我们的方法将利用软件包的工程知识，并将它们与先进的计算算法相结合，以实现快速准确的建模和优化。这项工作将帮助高速封装行业的设计人员在更短的时间内获得更好的设计方案，提高设计效率，加快设计周期。它提升了电磁建模和优化技术的最先进水平，并为加拿大信息和通信技术部门培养高素质的技术人员。****

This project addresses the challenges in designing high-speed electronic packages which are fundamental building blocks in next-generation networks such as 5G wireless networks, and IoT networks. As the signal speed in the electronic devices and packages continue to increase as demanded by the next generation networks, the electromagnetic effects in the electronic packages become significant. Electromagnetic based design and optimization become necessary. Significant research progress over the past two decades has made electromagnetic simulation nowadays widely used in the analysis and verification of high-speed/high-frequency electronic design. However, electromagnetic optimization is still challenging and computationally expensive due to the need of highly repetitive electromagnetic simulations with repetitive changes in physical/geometrical parameters. This research addresses such challenges, and develops new methods for electromagnetic parametric modeling and optimization of high-speed packages. The parametric models will allow quick evaluation of electromagnetic behavior with respect to changes in physical/geometrical variables. The optimization algorithm will automatically adjust the physical/geometrical parameters to achieve optimal electromagnetic behavior of the high-speed packages. Our methods will exploit engineering knowledge of the packages and combine them with advanced computational algorithms for fast and accurate modeling and optimization. This work will help designers in the high-speed package industry to achieve better design solutions in shorter time, increase design efficiency, and speedup design cycle. It elevates the state of the art of electromagnetic modeling and optimization technology, and trains highly qualified technical personnel for the Canadian information and communication technology sector. ****