Exploiting Defect Clustering Information in VLSI Testing

该项目正在研究如何使用有关晶片上缺陷聚集的信息，根据相邻芯片的测试结果对单个芯片进行成品率预测。假设晶片上的缺陷是聚集的，因此大多数好的芯片靠近其他好的芯片，而大多数有缺陷的芯片靠近其他芯片。然后，集群信息可用于针对晶片上的单个管芯进行特定测试。使用已发表文献中的晶片缺陷分布数据进行模拟，以评估该方法的可行性。正在开发准确的模型来预测可达到的缺陷水平，并正在确定在晶片上测试芯片的策略。

This project is investigating the use of information about defect clustering on wafers to make yield predictions for individual dies based on test results for neighboring dies. The hypothesis is that defects on a wafer are clustered, thus most good dies are close to other good ones and most defective dies are close to others. Clustering information can then be used for targeting particular tests to individual dies on the wafer. Simulations using wafer defect distribution data from the published literature is being employed to assess the viability of the approach. Accurate models to predict defect levels attainable are being developed and strategies for testing dies on the wafer are being determined.