The Sub-Atomic Measuring Machine

将建造一台横向范围为25×25毫米，垂直范围为100微米的亚原子测量机。之前开发的一个阶段将作为基础。建造世界上最精确的原子尺度特征超过IC芯片尺寸样本的测量机，立即为集成电路的计量提供了一种新的仪器。还将演示适用于0.1um及更小特征尺寸的集成电路生产的晶片步进器和扫描器的设计原理。因此，计量和制造机械设计技术都将得到发展。主要任务是开发具有系统固有精度的计量近场扫描光学显微镜(NSOM)或其他扫描探针显微镜，测量由惠普制造并在德国Physikalische Technische Bundesanstalt(PTB)校准的样品栅板(掩模)，并使用自校准技术将工作台的所有误差映射到比目前仪器更好的IO因数水平。该项目可能会产生必要的方法和仪器，以推动宏观物体的定位在商业上具有重要意义的范围内达到亚原子精度。这些精度和范围将是下一代微电路所需要的。

A subatomic measuring machine with a lateral range of 25 x 25 mm and a vertical range of100 um is to be built. A previously developed stage will be used as a base. Building the world's most accurate measuring machine for atomic-scale features over IC-chip size sample is immediately to provide a novel instrument for the metrology of integrated circuits. Principles applicable to the design of wafer steppers and scanners for the production of integrated circuits in 0.1 um and smaller feature sizes are going to also be demonstrated. Thus, both metrology and manufacturing machine design techniques will be developed. Major tasks are to develop a metrology near-field scanning optical microscope (NSOM) or other scanned probe microscope that has the inherent accuracy of the system, to measure a sample grid plate (mask) that was manufactured by Hewlett Packard and calibrated at the Physikalische Technische Bundesanstalt (PTB) in Germany and to use self-calibration techniques to map all of the errors of the stage to a level at least a factor of IO better than current instruments. The project is likely to generate the methodology and instrumentation necessary to push positioning of macroscopic objects to subatomic accuracies over commercially significant ranges. These accuracies and ranges will be required by the next generation of micro-circuits.