Semiconductor: Fab-wide Control and Disruption Management in High Volume Semiconductor Manufacturing

半导体：大批量半导体制造中的晶圆厂范围控制和中断管理

• 批准号: 0432433
• 负责人: S. Joe Qin
• 金额: --
• 依托单位: University of Texas at Austin
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2004
• 资助国家: 美国
• 起止时间: 2004-10-01 至 2008-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0432433&HistoricalAwards=false
• 关键词: Semiconductor; Fab; wide; Control; Disruption

The semiconductor industry has advanced from 200mm to 300mm wafers and will transition to 450mm by 2012 according to the roadmap of the Semiconductor Industry Association. Along with this transition is the doubling or tripling of capital expenditure. The aim of this project is to develop new control and optimization methods to improve the yield and reduce operational cost in semiconductor manufacturing. This grant provides funding to develop a new hierarchical control and optimization framework for high volume manufacturing and a novel disruption management methodology for real-time operations recovery in an uncertain manufacturing environment. The new hierarchical control framework makes use of the multilevel measurement available in a modern fab to achieve on-target manufacturing of electrical properties and geometric specifications. The real-time disruption management provides real time recovery to ensure on-time delivery when unexpected tool shutdowns or uncontrollable disruptions occur. The proposed tasks are tightly coupled in that the disruption management system is integrated with fab-wide control to provide control-friendly production schedules and sequences. The proposed methods deal with complex manufacturing issues with the power of sophisticated nonlinear optimization theory to help industry make intelligent real time decisions and control. This project, if successful, will provide a fab-wide control framework and real time disruption management system to improve competitiveness of the U.S. semiconductor industry as it is transitioning to 300mm technology and 450mm technology in the foreseeable future. On-target product quality will be optimally controlled with minimal waste of raw material and resources. Manufacturing equipment, which is very expensive now, will have improved utilization and reduced idle time. The fab operations will be less dependent on the manual operation of the fab personnel and the overall competitiveness of the U.S. chip manufacturing will be improved. The intellectual merit of the project is highlighted by the creation of a new framework and method for semiconductor manufacturing control and operations. The proposed fab-wide control framework and disruption management will contribute significantly to the knowledge of operations and control in semiconductor manufacturing.

根据半导体工业协会的路线图，半导体工业已经从200 mm发展到300 mm，到2012年将过渡到450 mm。沿着这一转变的是资本支出的两倍或两倍。本计画的目的是发展新的控制与最佳化方法，以提高半导体制程的良率，降低制程成本。这笔赠款提供资金，以开发一个新的分层控制和优化框架，用于大批量制造和一个新的中断管理方法，用于在不确定的制造环境中进行实时操作恢复。新的分层控制框架利用现代化工厂中的多级测量来实现电气性能和几何规格的目标制造。实时中断管理提供了真实的时间恢复，以确保在发生意外的工具关闭或无法控制的中断时按时交付。所提出的任务是紧密耦合的中断管理系统集成与工厂范围的控制，以提供控制友好的生产计划和序列。所提出的方法处理复杂的制造问题的复杂的非线性优化理论的力量，以帮助工业智能真实的时间决策和控制。 该项目如果成功，将提供一个全晶圆厂控制框架和真实的时间中断管理系统，以提高美国半导体行业的竞争力，因为它正在过渡到300毫米技术和450毫米技术在可预见的未来。目标产品质量将得到最佳控制，原材料和资源的浪费最小。现在非常昂贵的制造设备将提高利用率并减少空闲时间。晶圆厂运营将减少对晶圆厂人员手工操作的依赖，美国芯片制造业的整体竞争力将得到提升。该项目的智力价值突出表现在为半导体制造控制和操作创建了新的框架和方法。建议的晶圆厂范围内的控制框架和中断管理将大大有助于在半导体制造的操作和控制的知识。