Investigation of Ultraprecision Surface Creation and Subsurface Damage Evolution in Silicon Carbide

这项研究旨在将单晶和多晶碳化硅的超精密加工与高分辨率表面区分析相结合。尽管近表面损伤对碳化硅制造的电子和机械元件的功能有很大影响，但到目前为止，这一领域的研究还很少。因此，本项目将系统地研究基于经济型磨料加工工艺的单晶和多晶碳化硅中无损伤近表面区域的产生。如何避免材料凹坑和裂缝可以从最先进的技术中得出。在此基础上，该方案将通过高分辨率表面区分析来分析迄今未考虑的物理近表面区变化，如残余应力和晶格应变，可能发生的相变、晶格无序和变形。这些发现将与加工条件相关联。该项目是通过由墨卡托伙伴模块补充基本模块来实现的。单晶和多晶碳化硅超精密加工的基本原理将在基本模块内进行，方法是使用由粗颗粒金刚石磨料和细颗粒磨料组成的工程砂轮进行精磨，以及机械和化学机械抛光。墨卡托FLOOR模块将应用高分辨率表面区分析方法来调查机械加工过程导致的近表面损伤。

The proposed study is aimed at combining the ultraprecision machining of single crystal and polycrystalline silicon carbide and high resolution surface zone analysis. Though near surface damage has a significant influence on the functionality of electronic and mechanical components made from silicon carbide, not much research is know within this field so far. Therefore, this project will systematically investigate the generation of damage free near surface zones in single crystal and polycrystalline silicon carbide based on economical abrasive machining processes. How to avoid material pits and cracks can be derived from the state of the art. On this basis the proposal will analyze so far not considered physical near surface zone alterations like residual stresses and lattice strains, possibly occurrence of phase transformations, lattice disorder and deformation by high resolution surface zone analysis. These findings will be correlated with machining conditions.The project is realized by supplementing a basic module by a Mercator fellow module. The fundamentals for the ultraprecision machining of single crystal and polycrystalline silicon carbide will be performed within the basic module by applying fine grinding with engineered grinding wheels consisting of coarse grain diamond abrasives and fine grain abrasives as well as mechanical and chemomechanical polishing. The Mercator fellow module will apply methods of high resolution surface zone analysis to investigate near surface damage induced by machining processes.