Ultra-precise high-speed milling

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The exceedingly long processing times involved in raster milling of non-rotationally symmetric optical surfaces with single crystal diamond tools can be cut down by a factor of 10 by applying ultra-precision high-speed milling. While in the first funding period high-speed milling of metal substrates has been investigated, the second funding period is devoted to the ductile machining of brittle materials, in particular the high-speed diamond milling of IR-materials like singe crystal germanium, silicon, zinc selenide and zinc sulfide. The aim of the project is the verification of an increase of the critical depth of cut and a transition to adiabatic shearing with increasing cutting speed in the ductile material removal mode leading to a reduction of tool diamond wear as in the case of metal substrates. Finally, the technological basis established in both funding periods shall be applied for realizing high-speed raster milling and spiral milling including the components and methods developed within the other research projects of the research group using the common experimental platform with ultraprecise electromagnetic bearings.