2022 Device Research Conference
2022年器件研究会议
基本信息
- 批准号:2227544
- 负责人:
- 金额:$ 1万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:2022
- 资助国家:美国
- 起止时间:2022-06-15 至 2023-05-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
Non-Technical Description: This project will use NSF support to increase student participation and enhance technical training at the 80th Device Research Conference (DRC), which brings together researchers from around the world to share their latest findings in the areas of electronic, opto-electronic, and quantum-based semiconductor devices. The 2022 DRC will be held from June 26-29 at the Ohio State University, Columbus, OH. While in-person attendance is strongly encouraged, the 2022 DRC will be available in a partial hybrid format for those unable to travel. The DRC offers unique training and networking opportunities, particularly to its student and young investigator attendees, helping them advance their careers in materials science, semiconductor technology, and device engineering. In addition, the DRC is committed to fostering greater diversity and equity for all attendees and at all levels. By stimulating an open and frank discussion of recent breakthroughs and advances in electronic and photonic devices, the DRC will remove barriers for underrepresented minority groups and support the NSF’s Diversity Mission related to “preparing a diverse, globally engaged science, technology, engineering and mathematics workforce.” Technical Description: The 2022 DRC will feature three plenary talks from world-renowned researchers in quantum photonic devices, ferroelectric devices, and electronics for extreme application environments. The conference will include presentations on devices for IoT, spintronic devices, memory devices, RF and terahertz devices, thin-film devices, and heterogeneous integration. In addition to plenary talks and oral presentations, the 2022 DRC will offer a half-day technical short course in “Cryogenic Computing Devices” taught by prominent experts from academia and industry. The 2022 DRC will also feature two concurrent rump sessions titled “The Intersection of Industry and Academia: Training Future Researchers” and “What Should Be the Role of Computational Physics and Modeling in Enabling Next Generation Devices?” to engage the audience in a vigorous and open discussion on these important topics. To encourage student engagement, the DRC gives awards every year for the Best Student Paper and the Best Student Poster. The conference program, including the rump session and the short course, will enhance the professional knowledge of all attendees. The information will be disseminated widely through conference proceedings.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
非技术描述:该项目将利用美国国家科学基金会的支持来增加学生参与和加强第80届设备研究会议(DRC)的技术培训,该会议汇集了来自世界各地的研究人员,分享他们在电子、光电和量子半导体设备领域的最新发现。2022年刚果民主共和国将于6月26日至29日在俄亥俄州哥伦布市的俄亥俄州立大学举行。虽然强烈鼓励亲自出席,但2022年刚果民主共和国将以部分混合形式提供给无法旅行的人。DRC提供独特的培训和交流机会,特别是对学生和年轻的研究者与会者,帮助他们在材料科学,半导体技术和设备工程方面发展自己的职业生涯。此外,DRC致力于为所有参会者和各级参会者提供更大的多样性和公平性。通过鼓励对电子和光子器件的最新突破和进展进行公开和坦率的讨论,DRC将消除代表性不足的少数群体的障碍,并支持NSF的多元化使命,即“培养多元化的、全球参与的科学、技术、工程和数学人才”。技术描述:2022年DRC将举办三场全体会议,来自世界知名的量子光子器件,铁电器件和极端应用环境电子研究人员。会议将包括物联网设备、自旋电子设备、存储设备、射频和太赫兹设备、薄膜设备和异构集成等方面的演讲。除了全体会议和口头报告外,2022年DRC还将提供为期半天的“低温计算设备”技术短期课程,由学术界和工业界的知名专家授课。2022年的DRC还将同时举办两场会议,题为“工业和学术界的交叉点:培训未来的研究人员”和“计算物理和建模在实现下一代设备中的作用应该是什么?”,让观众就这些重要主题进行激烈而开放的讨论。为了鼓励学生的参与,DRC每年都会颁发最佳学生论文和最佳学生海报奖。会议计划,包括最后环节和短期课程,将提高所有与会者的专业知识。这些资料将通过会议记录广泛传播。该奖项反映了美国国家科学基金会的法定使命,并通过使用基金会的知识价值和更广泛的影响审查标准进行评估,被认为值得支持。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Shaloo Rakheja其他文献
Shaloo Rakheja的其他文献
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{{ truncateString('Shaloo Rakheja', 18)}}的其他基金
CAREER: A multi-scale and hierarchical computational framework to model III-nitride devices operating in the near-terahertz regime
职业:多尺度和分层计算框架,用于模拟在近太赫兹区域运行的 III 族氮化物器件
- 批准号:
2237663 - 财政年份:2023
- 资助金额:
$ 1万 - 项目类别:
Continuing Grant
IUCRC Phase I: University of Illinois at Urbana-Champaign (UIUC): Center for Advanced Semiconductor Chips with Accelerated Performance (ASAP)
IUCRC 第一阶段:伊利诺伊大学厄巴纳-香槟分校 (UIUC):具有加速性能的先进半导体芯片中心 (ASAP)
- 批准号:
2231625 - 财政年份:2023
- 资助金额:
$ 1万 - 项目类别:
Continuing Grant
79th Device Research Conference. To Be Held Virtually June 20-23, 2021.
第 79 届设备研究会议。
- 批准号:
2133323 - 财政年份:2021
- 资助金额:
$ 1万 - 项目类别:
Standard Grant
IUCRC Planning Grant University of Illinois: Center for Aggressive Scaling by Advanced Processes for Electronics and Photonics (ASAP)
IUCRC 规划拨款伊利诺伊大学:电子和光子学先进工艺积极扩展中心 (ASAP)
- 批准号:
2052749 - 财政年份:2021
- 资助金额:
$ 1万 - 项目类别:
Standard Grant
SHF: EAGER: Toward Energy-Efficient Heterogeneous Computing Integrating Polymorphic Magnetic and CMOS Devices
SHF:EAGER:迈向集成多态磁性和 CMOS 器件的节能异构计算
- 批准号:
1930620 - 财政年份:2019
- 资助金额:
$ 1万 - 项目类别:
Standard Grant
SHF: EAGER: Toward Energy-Efficient Heterogeneous Computing Integrating Polymorphic Magnetic and CMOS Devices
SHF:EAGER:迈向集成多态磁性和 CMOS 器件的节能异构计算
- 批准号:
2021230 - 财政年份:2019
- 资助金额:
$ 1万 - 项目类别:
Standard Grant
CRII: SHF: WINGS -- Wireless Interconnects for Next-Generation Systems
CRII:SHF:WINGS——下一代系统的无线互连
- 批准号:
1565656 - 财政年份:2016
- 资助金额:
$ 1万 - 项目类别:
Standard Grant
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