Magnet-free microwave sputter deposition with uniform target utilization

本研究的目的是为微波等离子体二维均匀溅射系统的开发提供指导。通过本课题的研究，成功地实现了利用微波功率生产低压等离子体。此外，通过在微波等离子体上施加射频功率，实现了面积为10 cm的均匀介质溅射。这是传统的利用磁场的溅射系统无法实现的创新成果。该项目所取得的成果可应用于各种电子器件的制造。

The purpose of this research is to obtain guideline for the development of two-dimensionally-uniform sputtering system using mirowave plasma production. Through this research, low pressure plasma production using microwave power is successfully realized. Furthermore, by applying RF power to the microwave plasma, uniform dielectric sputtering is realized with 10 cm square area. This is innovative result that cannot be realized by conventional sputtering system that utilize magnetic field. The result obtained by this project can be applied to various electronic device manufacturing.