Magnet-free microwave sputter deposition with uniform target utilization

本研究的目的是为微波等离子体生产二维均匀溅射系统的发展提供指导。通过本研究，成功实现了微波功率低压等离子体生产。此外，通过对微波等离子体施加射频功率，实现了10cm平方面积的均匀介电溅射。这是利用磁场的传统溅射系统无法实现的创新成果。本课题的研究成果可应用于各种电子器件的制造。

The purpose of this research is to obtain guideline for the development of two-dimensionally-uniform sputtering system using mirowave plasma production. Through this research, low pressure plasma production using microwave power is successfully realized. Furthermore, by applying RF power to the microwave plasma, uniform dielectric sputtering is realized with 10 cm square area. This is innovative result that cannot be realized by conventional sputtering system that utilize magnetic field. The result obtained by this project can be applied to various electronic device manufacturing.