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Control of Metal-Compound Semiconductor Interfaces by Formation of Nano-Scale Schottky Contacts and Its Application

Control of Metal-Compound Semiconductor Interfaces by Formation of Nano-Scale Schottky Contacts and Its Application
纳米级肖特基接触对金属-化合物半导体界面的控制及其应用
批准号:
11450115
负责人:
HASEGAWA Hideki
金额:
$9.66万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (B).
财政年份:
1999
资助国家:
日本
项目状态:
已结题
起止时间:
1999 至 2000

项目摘要

项目成果

HASEGAWA Hideki的其他基金

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中文摘要
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英文摘要
The purpose of this research was attempt to control metal-compound semiconductor interfaces by forming size-controlled nano-Schottky contacts and thereby removing the Fermi level pinning. The main results obtained are listed below :(1)Metal-semiconductor(M-S)interfaces formed by an electrochemical process was found to consist of metal nano-dots. By changing applied pulse conditions, dot size and the number of the dots could be controlled. Formation of small and uniform-size-metal dot relaxes Fermi level pinning at M-S interfaces and enhanced the metal-workfunction dependence of Schottky barrier heights. This opened up a possibility to control Schottky barrier heights toward the Schottky limit.(2)By the combination of the electrochemical process and electron-beam lithography techniques, a few ten nanometer-size nano-Schottky line gates and a few ten nanometer-sized highly uniform nano-dot arrays were successfully formed.(3)Current transport through M-S interfaces in single metal nano-dot-compound semiconductor systems was investigated by a conductive tip atomic force microscopy(AFM). The transport mechanism was theoretically studied by a newly developed device simulator for nano-Schottky interfaces. In the single metal-dot nano-Schottky contacts, reduction of the metal nano-dot size enhanced the metal-workfunction dependence. However, environmental surface Fermi level pinning around the nano-Schottky gates was found to affect strongly the potential control.(4)Nano-Schottky interface formation technology utilizing the electrochemical process were applied to realization of various quantum devices including GaAs-and InGaAs-based quantum wire transistors, single electron devices and memory devices. The fabricated devices showed proper and designed operations, and the effectiveness of the present technology was confirmed.
期刊论文(386)
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会议论文
S.Ootomo: "Nitridation of GaP (100) Surfaces by rf Nitrogen Radicals and by Electron Cyclotron Resonance Nitrogen Plasma"Jpn. J. Appl. Phys.. 39. 2407-2413 (2000)
S.Ootomo:“通过射频氮自由基和电子回旋共振氮等离子体对 GaP (100) 表面进行氮化”Jpn。
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通讯作者:
H.Sai: "Growth of Device Quality InGaP/GaAs Heterostructures by Gas Source Molecular Beam Epitaxy Using Tertiarybutylphosphine"Solid State Electronics. 43. 1541-1546 (1999)
H.Sai:“使用叔丁基膦通过气源分子束外延提高器件质量 InGaP/GaAs 异质结构”固态电子学。
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J.Nakamura: "Transport Properties of Schottky In-Plane-Gate GaAs Single and Coupled Quantum Wire Transistors"Inst.Phys.Conf.Ser.. 162. 409-414 (1999)
J.Nakamura:“肖特基平面栅极 GaAs 单晶体管和耦合量子线晶体管的传输特性”Inst.Phys.Conf.Ser.. 162. 409-414 (1999)
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T. Sato: "Electrical Properties of Nanometer-Sized Schottky Contacts on n-GaAs and n-InP Formed by in situ Electrochemical Process"Japanese Journal Applied Physics. (in press). (2000)
T. Sato:“通过原位电化学过程形成的 n-GaAs 和 n-InP 上纳米尺寸肖特基接触的电特性”日本应用物理学杂志。
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