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LOW MASS LOW POWER RADIATION RESISTANT PIXEL MODULES

低质量低功耗抗辐射像素模块

基本信息

批准号：
ST/L002434/1
负责人：
Richard Bates
金额：
$ 32.54万
依托单位：
University of Glasgow
依托单位国家：
英国
项目类别：
Research Grant
财政年份：
2014
资助国家：
英国
起止时间：
2014 至无数据
项目状态：
已结题

来源：
https://gtr.ukri.org/projects?ref=ST%2FL002434%2F1
关键词：
LOW MASS POWER RADIATION RESISTANT

项目摘要

Particle physicists wish to reconstruct with high fidelity and 100% efficiency the trajectories of the products from physics interactions. For this the secret for success is well known: high-resolution minimal mass detector systems. While modern carbon composites, and novel cooling concepts enable a lower mass system, the key to low mass is a low power detector module.This project addresses the key elements to obtain a low power pixel assembly by replacing the sensor element with a CMOS sensor. The CMOS sensor will also replace the first stage of the analogue amplification. This will reduce the power dissipated in the sensor and the readout electronics.The CMOS sensors to be developed is based on an application of the HVCMOS technology commonly used for automotive electronics control. The HVCMOS sensor has a depleted sensing volume that allows fast and full charge collection even after irradiation. This is unlike most CMOS sensor technologies which rely on a slower drift process that is significantly affected by non-ionizing radiation damage.The ROIC will still be used to process the data from the sensor as done in a standard pixel hybrid assembly. The advantage of this is to allow the full power of the ROIC to be utilized.The HVCMOS sensor is attached with a simple glue joint to a standard Particle physics readout pixel chip. The signal is capacitivly coupled from the HVCMOS sensor to the ROIC. This simple assembly procedure, and cheap sensor, will significantly reduce the cost of the production of pixel modules which will allow them to be used more widely in particle physics experiments. Therefore extending the physics reach of a given experiment.As the assembly procedure is very straight forward, gluing two items together, it will be possible to thin both the devices down to 50-100 micrometers each which will result in a mass reduction in the module.

粒子物理学家希望以高保真度和100%效率重建物理相互作用产物的轨迹。成功的秘诀是众所周知的：高分辨率的最小质量检测器系统。虽然现代的碳复合材料和新颖的冷却概念可以实现更低质量的系统，但低质量的关键是低功耗的探测器模块。该项目通过用CMOS传感器取代传感器元件来解决获得低功耗像素组件的关键要素。CMOS传感器也将取代模拟放大的第一级。这将降低传感器和读出电子设备的功耗。即将开发的CMOS传感器基于汽车电子控制中常用的HVCMOS技术的应用。HVCMOS传感器具有耗尽的感应体积，即使在照射后也可以快速、完全地收集电荷。这与大多数CMOS传感器技术不同，后者依赖于受非电离辐射损伤显著影响的较慢漂移过程。ROIC仍将用于处理来自传感器的数据，就像在标准像素混合组件中所做的那样。这样做的好处是可以充分利用读出电路的功率。HVCMOS传感器通过简单的胶接连接到标准粒子物理读出像素芯片上。信号从HVCMOS传感器电容性地耦合到ROIC。这种简单的组装过程和廉价的传感器将大大降低像素模块的生产成本，使其能够更广泛地用于粒子物理实验。由于组装过程非常简单，只需将两个部件粘合在一起，因此可以将两个器件都减薄到50-100微米，从而减少模块的质量。