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Deep x-ray lithography for high aspect ratio applications

Deep x-ray lithography for high aspect ratio applications
适用于高深宽比应用的深度 X 射线光刻
批准号:
327243-2009
负责人:
Achenbach, Sven
金额:
$2.77万
依托单位:
依托单位国家:
加拿大
项目类别:
Discovery Grants Program - Individual
财政年份:
2011
资助国家:
加拿大
项目状态:
已结题
起止时间:
2011-01-01 至 2012-12-31

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英文摘要
Our technologically driven world constantly demands improved performance in all classes of devices ranging from cellular phones to automotive sensors and from medical implants to hard disk read/write heads. This generally requires reduced geometric dimensions, and micro- and nanotechnology are therefore more and more often replacing conventional fabrication technologies. One fabrication approach delivering outstanding structure quality, and therefore device performance, is deep X-ray lithography (XRL) and the LIGA process. These techniques will finally be available in Canada as SyLMAND, the Synchrotron Laboratory for Micro and Nano Devices at the Canadian Light Source in Saskatoon, gets operational.
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