Deep x-ray lithography for high aspect ratio applications

适用于高深宽比应用的深度 X 射线光刻

• 批准号: 327243-2009
• 负责人: Achenbach, Sven
• 金额: $ 2.77万
• 依托单位: University of Saskatchewan
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2015
• 资助国家: 加拿大
• 起止时间: 2015-01-01 至 2016-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=571959
• 关键词: Deep; ray; lithography; aspect; ratio

Our technologically driven world constantly demands improved performance in all classes of devices ranging from cellular phones to automotive sensors and from medical implants to hard disk read/write heads. This generally requires reduced geometric dimensions, and micro- and nanotechnology are therefore more and more often replacing conventional fabrication technologies. One fabrication approach delivering outstanding structure quality, and therefore device performance, is deep X-ray lithography (XRL) and the LIGA process. These techniques will finally be available in Canada as SyLMAND, the Synchrotron Laboratory for Micro and Nano Devices at the Canadian Light Source in Saskatoon, gets operational. XRL technologies allow for a broad range of applications, but still require significant research efforts to fully exploit the potential. Dr. Sven Achenbach therefore designed SyLMAND to become a unique research facility. His research will partly focus on XRL mask fabrication. Its quality limits the final results of the microstructures, and therefore needs to get optimized. Key issues include minimum micro feature resolution and maximum overall mask size. Better resolution allows for smaller, more advanced devices and better tolerances in larger components. Larger mask areas enable more devices to be processed at a time, or more complicated, distributed structures. At the same time, the technology must enable reliable and cost-effective mask fabrication, both of which impose major challenges. SyLMAND offers unique capabilities to develop and apply advanced masks. To effectively apply micro technology, individual micro components fabricated with an optimized mask need to get integrated into more complex micro systems. This is particularly complicated in XRL, and related research is an additional thrust. Results from the mask technology and systems integration areas will get merged to collaboratively develop next-generation wireless devices which are required, for instance, in cellular phones and wireless LANs.

我们这个由技术驱动的世界不断要求提高各类设备的性能，从手机到汽车传感器，从医疗植入物到硬盘读/写头。这通常需要减少几何尺寸，因此微米和纳米技术正越来越多地取代传统的制造技术。深X射线光刻(XRL)和LIGA工艺是一种提供卓越结构质量和器件性能的制造方法。这些技术最终将在加拿大萨斯卡通的加拿大光源同步加速器微纳设备实验室SyLMAND投入使用。 XRL技术允许广泛的应用，但仍需要大量的研究努力才能充分挖掘潜力。因此，Sven Achenbach博士将SyLMAND设计为一个独特的研究机构。他的研究将部分集中在XRL掩模制造上。它的质量限制了微结构的最终结果，因此需要进行优化。关键问题包括最小微特征分辨率和最大总体掩模尺寸。更好的分辨率允许更小、更先进的设备，以及更大组件的容差。更大的掩模面积可以同时处理更多的设备，或者更复杂的分布式结构。与此同时，该技术必须能够实现可靠和成本效益高的掩模制造，这两者都带来了重大挑战。SyLMAND提供开发和应用高级口罩的独特功能。 为了有效地应用微技术，用优化的掩模制造的单个微部件需要集成到更复杂的微系统中。这在XRL中尤其复杂，相关研究是额外的推力。 来自MASK技术和系统集成领域的成果将被合并，以合作开发例如蜂窝电话和无线局域网所需的下一代无线设备。