Scanning Acoustic Microscope to Probe Voids and Interfaces in Functionalized Materials and Hybrid Devices

扫描声学显微镜探测功能化材料和混合器件中的空隙和界面

• 批准号: 422915-2012
• 负责人: Moutanabbir, Oussama
• 金额: $ 10.45万
• 依托单位: École Polytechnique de Montréal
• 依托单位国家: 加拿大
• 项目类别: Research Tools and Instruments - Category 1 (<$150,000)
• 财政年份: 2011
• 资助国家: 加拿大
• 起止时间: 2011-01-01 至 2012-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=495867
• 关键词: Scanning; Acoustic; Microscope; Probe; Voids

The recently deployed wafer bonding capabilities at Ecole Polytechnique create a wealth of opportunities to develop a new class of hybrid devices by allowing large scale integration of materials with different properties in the same platform thereby achieving single multifunctional entities. Assessing the quality of bonded interface and its behavior during processing is of the utmost importance in order to exploit the full potential of this heterogeneous integration. The interface between dissimilar materials plays a central role in shaping the physical, chemical, optical, and electrical properties of engineered heterostructures and hence defines the reliability and performance of a variety of current and emerging hybrid technologies. Therefore, a precise inspection of interfaces is crucial to verify the quality of the fabricated hybrid devices and to track their long-term stability, which is of compelling importance to optimize various fabrication, functionalization, and integration processes. With this perspective and to establish the characterization infrastructure that complements our wafer bonding facilities, we seek to set up a scanning acoustic microscope, which enables a non-destructive, high resolution, and sensitive imaging of buried interfaces. This microscope works like a sonar, sending a high frequency acoustic signal and measuring the time it takes to reflect back to the detector. It is particularly sensitive to voids, cavities, porosity, delaminations, cracks, and particles trapped between two joint surfaces thus providing valuable insights into microstructural characteristics of materials. The microscope will be managed by the Microfabrication Laboratory which hosts state-of-the-art facilities accessible to all researchers from public and private sectors. The microscope will be central to advance research activities in microelectronics, optoelectronics, photonics, photovoltaics, microfluidics, electromechanics, and surface coating technologies. The acquisition of the SAM will also offer an excellent opportunity to enhance the training of highly qualified personnel

最近在Ecole Polytechnique部署的晶圆键合能力创造了大量的机会，通过允许在同一平台上大规模集成具有不同属性的材料，从而实现单一的多功能实体，来开发新型混合器件。为了充分发挥这种异质集成的潜力，评估粘接界面的质量及其在加工过程中的行为至关重要。不同材料之间的界面在形成工程异质结构的物理，化学，光学和电学特性方面起着核心作用，因此定义了各种当前和新兴混合技术的可靠性和性能。因此，对界面的精确检测对于验证所制造的混合器件的质量并跟踪其长期稳定性至关重要，这对于优化各种制造，功能化和集成工艺具有极其重要的意义。从这个角度来看，并建立表征基础设施，补充我们的晶圆键合设施，我们寻求建立一个扫描声学显微镜，它可以实现非破坏性的，高分辨率，和埋界面的灵敏成像。这种显微镜的工作原理就像声纳，发送高频声信号并测量反射回探测器所需的时间。它对空隙、空腔、孔隙、分层、裂纹和夹在两个接合表面之间的颗粒特别敏感，从而为材料的微观结构特征提供有价值的见解。显微镜将由微加工实验室管理，该实验室拥有最先进的设施，可供来自公共和私营部门的所有研究人员使用。该显微镜将是推进微电子学、光电子学、光子学、光电子学、微流体学、机电学和表面涂层技术研究活动的核心。收购SAM还将提供一个极好的机会，以加强对高素质人员的培训