An Integrated Smart Power Harvesting Scheme from High Throughput Data Lines

在有线传感器网络中，传感器和控制单元之间安全可靠的数据通信以及为它们提供能量需要大量的布线束。另一方面，数据总线中预计会有很长的空闲时间。因此，一种有前景的节省和获取传感器及其接口电力的方法可能是基于利用空闲期来分配能量。当该技术与宽带隙和高压集成电路技术一起实施时，可以将应用扩展到那些受到恶劣和高压环境影响的人。 我们的目标是为有线网络，特别是传感器网络引入新的供电技术，其中许多线路分别传输数据和电力。该项目旨在为广泛的应用服务，这些应用需要同时进行数据和电力传输，特别是在航空航天领域。这些主要主题中的每一个都必须有助于定义适当的体系结构，以促进可靠的互连和 该项目致力于解决从数据线路向传感器网络中的外围设备提供能量的功率清除方案。这项研究包括以下补充部分：a)开发智能电源管理算法；b)研究在同一介质中结合数据传输和能量清除的最佳方法；c)宽禁带器件的开发及其特性；d)使该方案适应高温等恶劣环境条件；e)在传感器接口中引入用于激励信号发生路径的高能效高压线路(正弦)驱动器；以及f)使用COT和IC元件对电路进行小型化和封装。这里涉及标准和高压CMOS、混合和宽带隙技术。

In a wired sensor network, safe and reliable data communications between sensors and control units, and procuring energy to them involve bulky wiring bundles. On the other hand, significant idle period are expected in the data buses. Therefore, a promising means of saving and procuring power to sensors and their interfaces could be based on exploiting idle periods to distribute energy. the technique when implemented with wide bandgap and high voltage IC technologies can extend the application to those who are subject to harsh and high voltage environments. Our goal is to introduce new power up techniques for wired networks, sensor networks in particular, where many lines carry data and power separately. The project aims at serving the benefits to a broad range of applications, which are subjected to simultaneous data and power transfer, notably found in aerospace. Each of these main subjects must contribute to define an appropriate architecture to facilitate reliable interconnection and This project tackles solutions to introduce a power scavenging scheme from data lines to feed energy to peripherals in sensor networks. The research consists of the following complementary parts; a) development of a smart power management algorithm, b) investigation of the best means to combine data transfers and energy scavenging over a same medium, c) development of wide bandgap devices and their characterization, d) adaptation of the scheme to harsh environmental conditions such as high temperature, e) introduction of power efficient high voltage line (sine) driver for excitation signal generator path in sensor interfaces, and f) miniaturization and packaging of the circuits using COT and IC components. Here, standard and high-voltage CMOS, hybrid and wide bandgap technologies are involved.