RF MEMS switch for reliability and batch fabrication

交换机广泛应用于微波和射频（RF）系统中，以提供敏捷性和信号路由，从而有效利用可用频谱和实现组件冗余。微机电系统（MEMS）技术具有取代当今移动和卫星通信系统中使用的许多射频开关的潜力。在许多情况下，这种RF MEMS开关不仅可以大幅减小尺寸和功耗，而且与当前的开关技术相比，还可以保证优越的性能。随着使用越来越高的频率，RF-MEMS开关仍然很难实现两个挑战：以最小的信号退化运行高达20 GHz，以及高可靠性。舍布鲁克大学（美国）和滑铁卢大学（UW）与Teledyne DALSA半导体公司和魁北克Bromont的Gale微技术公司合作，提出了这个联合研究项目，通过开发能够工作高达20 GHz的封装可靠RF-MEMS来应对这些挑战。实现这些目标需要RF工程、机械工程、材料科学、微制造和封装技术领域的专业知识。拟议的项目汇集了一个多学科团队，开发一种新的RF MEMS微制造工艺流程，与我们的工业合作伙伴一致，解决可靠性问题和封装要求。制造将在MiQro创新协作中心（C2MI）最先进的200毫米MEMS洁净室基础设施中进行，该中心为开发具有工业级工艺和工具的RF MEMS开关提供了机会。

Switches are widely employed in microwave and radio frequency (RF) systems to provide agility and signalrouting for efficient use of available spectrum and for component redundancy. The Micro-Electro-Mechanical Systems (MEMS) technology has the potential of replacing many of RF switches used in today's mobile and satellite communication systems. In many cases, such RF MEMS switches would not only reduce substantially the size and power consumption, but also promise superior performance in comparison with current switch technologies. With the use of ever higher frequencies, two challenges remain very difficult to achieve for the RF-MEMS switches: functioning up to 20 GHz with minimal signal degradation, and high reliability. The University of Sherbrooke (U.S.) and the University of Waterloo (UW), in cooperation with Teledyne DALSA Semiconductor and Gale Micro-Technologies in Bromont (Quebec), propose this joint research project, to meet these challenges by developing packaged reliable RF-MEMS capable of operating up to 20 GHz. Achieving these goals requires expertise in the fields of RF engineering, mechanical engineering, materials science, microfabrication and packaging technology. The proposed project brings together a multidisciplinary team to develop a new RF MEMS microfabrication process flow consistent with those of our industrial partners addressing reliability concerns and packaging requirements. The fabrication will be carried out in the state-of-the-art 200 mm MEMS cleanroom infrastructure of the MiQro innovation Collaborative Center (C2MI) that provide the opportunity to develop RF MEMS switches with industrial-grade processes and tools.