RF MEMS switch for reliability and batch fabrication

RF MEMS 开关确保可靠性和批量制造

• 批准号: 479560-2015
• 负责人: Boone, François
• 金额: $ 10.86万
• 依托单位: Université de Sherbrooke
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2017
• 资助国家: 加拿大
• 起止时间: 2017-01-01 至 2018-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=618757
• 关键词: RF; MEMS; switch; reliability; batch

Switches are widely employed in microwave and radio frequency (RF) systems to provide agility and signalrouting for efficient use of available spectrum and for component redundancy. The Micro-Electro-Mechanical Systems (MEMS) technology has the potential of replacing many of RF switches used in today's mobile and satellite communication systems. In many cases, such RF MEMS switches would not only reduce substantially the size and power consumption, but also promise superior performance in comparison with current switch technologies. With the use of ever higher frequencies, two challenges remain very difficult to achieve for the RF-MEMS switches: functioning up to 20 GHz with minimal signal degradation, and high reliability. The University of Sherbrooke (U.S.) and the University of Waterloo (UW), in cooperation with Teledyne DALSA Semiconductor and Gale Micro-Technologies in Bromont (Quebec), propose this joint research project, to meet these challenges by developing packaged reliable RF-MEMS capable of operating up to 20 GHz. Achieving these goals requires expertise in the fields of RF engineering, mechanical engineering, materials science, microfabrication and packaging technology. The proposed project brings together a multidisciplinary team to develop a new RF MEMS microfabrication process flow consistent with those of our industrial partners addressing reliability concerns and packaging requirements. The fabrication will be carried out in the state-of-the-art 200 mm MEMS cleanroom infrastructure of the MiQro innovation Collaborative Center (C2MI) that provide the opportunity to develop RF MEMS switches with industrial-grade processes and tools.

开关广泛应用于微波和射频（RF）系统中，以提供灵活性和信号路由，从而有效地使用可用频谱并实现组件冗余。微电子机械系统（MEMS）技术具有替代当今移动的和卫星通信系统中使用的许多RF开关的潜力。在许多情况下，这样的RF MEMS开关将不仅显著地减小尺寸和功耗，而且与当前的开关技术相比还保证上级性能。随着频率越来越高，RF-MEMS开关仍然面临两个非常难以实现的挑战：以最小的信号衰减工作到20 GHz，以及高可靠性。The University of Sherbrooke（美国）和滑铁卢大学（UW），与Teledyne DALSA半导体和Gale Micro-Technologies在Bromont（魁北克）的合作，提出了这个联合研究项目，通过开发封装可靠的RF-MEMS能够工作到20 GHz来应对这些挑战。实现这些目标需要RF工程、机械工程、材料科学、微加工和封装技术领域的专业知识。拟议的项目汇集了一个多学科的团队，以开发一个新的RF MEMS微加工工艺流程与我们的工业合作伙伴解决可靠性问题和封装要求一致。制造将在MiQro创新合作中心（C2MI）最先进的200 mm MEMS洁净室基础设施中进行，该中心提供了利用工业级工艺和工具开发RF MEMS开关的机会。