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Design of high precision MEMS gyroscope compatible with wafer level packaging process (Micralyne "MicraSilQ")

Design of high precision MEMS gyroscope compatible with wafer level packaging process (Micralyne "MicraSilQ")
兼容晶圆级封装工艺的高精度MEMS陀螺仪设计(Micralyne“MicraSilQ”)
批准号:
531949-2018
负责人:
Ahamed, Mohammed
金额:
$1.82万
依托单位:
依托单位国家:
加拿大
项目类别:
Engage Grants Program
财政年份:
2018
资助国家:
加拿大
项目状态:
已结题
起止时间:
2018-01-01 至 2019-12-31

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中文摘要
翻译
陀螺仪是一种可以测量物体旋转速率的传感器。基于MEMS(微机电系统)的陀螺仪是使用基于半导体的微加工制造的微型传感器。MEMS陀螺仪具有广泛的优势,包括更小的尺寸,更轻的重量,更低的成本和更低的激励功率。MEMS陀螺仪使用一个小的振荡质量作为响应角运动的核心传感元件。振荡质量需要在真空下振动,以最大化其灵敏度和最小化漂移。真空隔离是必要的:(i)最大限度地减少由于空气阻尼引起的振动能量损失和(ii)保持易碎机械部件的完整性,免受灰尘或污染。多种真空封装方法可供选择,包括逐个芯片密封和晶圆级密封。单个器件的真空封装成本高,无法提供大规模生产,因此首选晶圆级封装。最近,Micralyne开发了一种晶圆级真空封装方法(MicraSilQTM)平台,提供了集成晶圆级制造和密封真空封装的一体化解决方案。它是一种经过验证的,具有成本效益的解决方案,适用于需要高精度,低噪音的加速和冲击测量机械传感的应用。利用这一工艺,** microalyne展示了高性能加速度计。然而,该平台也是MEMS陀螺仪的理想选择。Micralyne有兴趣开发与MicraSilQ兼容的陀螺仪设计。目前,没有MEMS陀螺仪设计方法可以适用于MicraSilQ高精度陀螺仪。该Engage资助将通过使用分析和数值建模技术为MicraSilQ平台开发MEMS陀螺仪设计。在航空航天、消费电子、生物医学、国防和自主应用领域,对高精度MEMS陀螺仪**有着巨大的需求。此次NSERC合作将是Micralyne Inc.与温莎大学的Jalal Ahamed博士之间的首次合作,旨在开发与晶圆级真空封装MicraSilQ平台兼容的MEMS陀螺仪。
英文摘要
A gyroscope is a sensor that can measure the rate of rotation of an object. MEMS (Microelectromechanical**Systems) based gyroscopes are miniature sensors that are fabricated using semiconductor based**microfabrication. MEMS gyroscopes offer a wide range of advantages, including smaller size, lighter weight,**lower cost, and lower excitation power. MEMS gyroscopes use a small oscillating mass as the core sensing**element that responses to angular motion. The oscillating mass needs to be vibrating under vacuum to**maximize its sensitivity and minimize drift. The vacuum isolation is necessary to: (i) minimize vibration**energy loss due to air damping and (ii) maintain integrity of the fragile mechanical component from dust or**contamination. Various vacuum packaging methods are available including sealing individual chip by chip**basis and wafer-level sealing. Individual device per device vacuum packaging is costly and fails to provide**mass manufacturing therefore wafer-scale packaging is preferred. Recently, Micralyne developed a wafer-scale**vacuum packaging method (MicraSilQTM) platform that offers an all-in-one solution integrating wafer-level**fabrication and hermetic vacuum packaging. It is a proven, cost-effective solution for applications requiring**high accuracy, low-noise mechanical sensing for acceleration and shock measurements. Using this process,**Micralyne showed high performance accelerometers. However, this platform is also ideal for MEMS**gyroscopes. Micralyne is interested to develop a gyroscope design compatible with MicraSilQ. Currently, there**is no MEMS gyroscope design approach available that can be suitable with MicraSilQ for high precision**gyroscopes. This Engage grant will develop a MEMS gyroscope design for MicraSilQ platform by using**analytical and numerical modelling techniques. There is a huge demand for high precision MEMS gyroscopes**in aerospace, consumer electronics, biomedical, defense, and autonomous applications. This NSERC Engage**will be the first collaborative effort between Micralyne Inc. and Dr. Jalal Ahamed of University of Windsor to**develop MEMS gyroscopes compatible with the wafer-scale vacuum packaged MicraSilQ platform.
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