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DAMAGELESS ETCHING PROCESSES

DAMAGELESS ETCHING PROCESSES
无损蚀刻工艺
批准号:
RGPIN-2016-03691
负责人:
Darnon, Maxime
金额:
$1.67万
依托单位:
依托单位国家:
加拿大
项目类别:
Discovery Grants Program - Individual
财政年份:
2022
资助国家:
加拿大
项目状态:
已结题
起止时间:
2022-01-01 至 2023-12-31

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中文摘要
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英文摘要
Plasma etching used in micro and nano fabrication is required for precise patterning of various materials. However, it also induces damage at the surface of the etched materials. The exact impact of these modifications on devices properties is not fully understood yet.In this program, we intend to improve the understanding of plasma-induced damage and to evaluate solutions to reduce the damage. We will use silicon, III-V materials and superconducting materials as test vehicles. These materials are used for integrated circuits, high efficiency solar cells and quantum computing devices fabrication. We will base our research on an extensive characterization of the surface of materials exposed to the plasma. Plasma diagnostics will also be used to correlate materials modification with plasma properties. Based on this information, we will develop processes with minimal plasma-induced damage and we will investigate alternative plasma etching processes. This program will provide processes that will participate in the fabrication of new devices such as higher efficiency solar cells or quantum computers. In addition, it will train five highly qualified people who will be well prepared to integrate the high tech industry and develop new products which will benefit Canada's economy.
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