The Sub-Atomic Measuring Machine

拟建立一台横向测量范围为25 × 25 mm，纵向测量范围为100 μ m的亚原子测量机。 以前开发的阶段将用作基础。 建立世界上最精确的原子尺度特征测量机，为集成电路的测量提供了一种新的仪器。 还将演示适用于生产0.1 μ m及更小特征尺寸集成电路的晶圆步进机和扫描仪设计的原则。 因此，计量和制造机器设计技术将得到发展。 主要任务是开发具有系统固有精度的计量近场扫描光学显微镜（NSOM）或其他扫描探针显微镜，测量由Hewlett Packard制造并在德国的Physikalische Technische Bundesanstalt（PTB）校准的样品栅格板（掩模），并使用自校准技术，以将载物台的所有误差映射到比当前仪器好至少10倍的水平。 该项目可能会产生必要的方法和仪器，以推动宏观物体的定位，以亚原子的精度在商业上有意义的范围。 下一代微电路将需要这些精度和范围。

A subatomic measuring machine with a lateral range of 25 x 25 mm and a vertical range of100 um is to be built. A previously developed stage will be used as a base. Building the world's most accurate measuring machine for atomic-scale features over IC-chip size sample is immediately to provide a novel instrument for the metrology of integrated circuits. Principles applicable to the design of wafer steppers and scanners for the production of integrated circuits in 0.1 um and smaller feature sizes are going to also be demonstrated. Thus, both metrology and manufacturing machine design techniques will be developed. Major tasks are to develop a metrology near-field scanning optical microscope (NSOM) or other scanned probe microscope that has the inherent accuracy of the system, to measure a sample grid plate (mask) that was manufactured by Hewlett Packard and calibrated at the Physikalische Technische Bundesanstalt (PTB) in Germany and to use self-calibration techniques to map all of the errors of the stage to a level at least a factor of IO better than current instruments. The project is likely to generate the methodology and instrumentation necessary to push positioning of macroscopic objects to subatomic accuracies over commercially significant ranges. These accuracies and ranges will be required by the next generation of micro-circuits.