Study of Reliability and Modeling for Process Optimization and Yield Improvements in Chemical Mechanical Planarization

本研究的目的是通过对低介电常数材料机械可靠性的实验评估来优化化学机械平坦化工艺。将对抛光中使用的材料和耗材(如垫子和浆料)进行广泛的表面后测量、机械和界面分析，以从不同角度对平坦化过程进行基本分析。这项研究将从根本上探讨耗材在表面缺陷产生中所起的作用。这项研究将允许优化焊盘设计、材料选择、工艺压力、轨道和线速度、化学溶液、晶片均匀性和局部平坦化。界面粘附性的建模将允许优化工艺条件、焊盘物理性能和化学添加剂，以减少薄膜堆栈的内部一致性和分层。与介质材料相关的可靠性问题将为提高成品率提供最佳解决方案，而不会影响产量。如果成功，这项调查的发现将导致设备和工艺设计的改进，并显著缩短设计周期和成本。这项研究将对集成度、设备产量和耗材开发产生深远影响，从而产生显著的经济回报。这项研究将被整合到研究人员计划的现有课程和新课程中，并将采取其他措施来激发本科生和少数族裔工程师对微电子行业的兴趣。结果将通过在国家/国际会议上的介绍和档案期刊上的出版物及时传播。

The objective of this research is to optimize the chemical mechanical planarization process using experimental evaluation of mechanical reliability of low dielectric constant materials. Extensive post surface metrology, mechanical and interfacial analysis of the materials, and consumables like pad and slurry used in polishing will be done to gain a fundamental analysis of the planarization process from different perspectives. The research will investigate the roles played by the consumables on surface defect generation at the fundamental level. This investigation will allow optimization of pad design, material selection, process pressure, orbital and linear speed, chemical solution, within wafer uniformity and local planarization. Modeling of interfacial adhesion will allow optimization of process conditions, pad physical properties, and chemical additives in order to reduce within uniformity and delamination of thin film stacks. Reliability issues related to dielectric materials will provide an optimal solution for improved yield without compromising the throughput.If successful, the finding of this investigation will result in improved equipment and process designs as well as significant reduction in design cycle time and cost. The research will have a profound impact on integration, device yield, and consumables development resulting in a significant economic payoff. The research will be integrated into existing and new courses in the investigators program and other steps will be taken to stimulate the interest of undergraduates and minority student engineers in microelectronics industries. The results will be disseminated in a timely manner through presentation at national/international conferences and publications in archival journals.