Crystallographical Control in Urtra-Precision Cutting

本课题的目的是从晶体学的角度对表面进行表征，研究的对象是经过超精密加工（切削）的表面，这种表征可以为控制合适的切削条件提供有用的信息。光反射光谱反映了晶体表面形貌的信息，并讨论了光反射光谱与晶体表面形貌的关系。以Si表面为例进行了理论计算，结果表明，测量装置的分辨率为0.001%，测量了半导体和金属表面不同的缺陷密度和尺寸。结果表明，利用光反射光谱进行表面表征，不仅对半导体表面，而且对金属表面都是有效的，从而获得了这种方法应用于评定微精密磨削表面的可能性。

The aim of this project is to characterize wefal suifaes on the crystallographical stand point and wain target of this study is the surfaces which are finished by ultera precision machining (cutling), and snch characterization can bring usefcul informations for Cmtrolling the suitable cuhing conditions.In this study, phat wflectane spectra measurmcnt is emploged. Photo vflectance Spectra have the imformations of surafce erystallographical clafect dcnsities.Relationship betwecn photo reflectance spectra and surfae latlie cecfrct dcusity was. maale clear through the thoeretical calculations on Si Surfaces as a sample material. Measuring apparatus withe the resolution of 0.001% was dcrelopeb, and both sewiconductor and mctal surfaces having dcffeent defect dcneities anr mcasure From there results, surfae characterization utilizing photo retlectamce spectra is power asefal not only in semi conductor surfae, but afsaimetal surface and possibility of the application for evaluation of the wekra precision cuhing surfaces of trhis meatod was obtained.