Analysis of Mechanism of Very fine Agglutinative Bonding Between Fine Gold Lead and Electric Pad On Integrated Circuit.

开发用于电子领域IC和LSI封装工艺的新型微连接技术是必不可少的技术。这是实现集成电路电极与引线框架等外部引线之间互连的基本技术，并不夸张。然而，那里使用的材料彼此不同，并且互连的优化并不容易。然后，在本研究中，集成电路电极和金丝和引线之间的键合机理进行了分析，并已澄清从实验和理论计算结果。特别是，阐明了材料特性（金细引线/金焊盘的机械特性之间的差异）、由键合负载增加引起的键合机制的转变、焊盘温度增加引起的导线变形的促进作用、以及键合工具形状对互连形成的影响等。而且， ...更多信息 本研究对预计在不久的将来非常重要的室温粘合机理进行了分析，研究了粘合后粘合强度随时间增加的现象并阐明了其机理。本研究具体得到的结果分为以下8点：1）材料性能、粘结压力、分析了键合温度对键合过程的影响; 2）分析了焊盘与细线之间的界面扩散行为以及应力分布随时间的变化; 3）分析了键合载荷增加时，键合机理的转变; 4）分析了键合温度对键合过程的影响焊盘和金丝变形过程的数值模拟; 5）键合工具对键合过程的影响分析; 6）焊盘厚度对键合界面扩展的影响以及金丝凸点对微连接的有效性; 7）金丝与焊盘的粘附键合过程理论，8）结合界面迁移现象和晶界沟槽异常形成的数值检验。少

It is indispensable technology to develop the new microjoining used for the packaging process of IC and LSI of the electronics field. This is the basic technology which achieves the interconnection between integrated circuit electrodes and external leads such as the leadframe, and it is not the exaggeration. However, the materials used there are dissimilar to each other, and the optimization of the interconnection is not easy. Then, in the present study, the bonding mechanism between integrated circuit electrodes and gold fine wires and leads is analyzed and has been clarified from experiments and theoretical calculation results. Especially, material properties (difference between the mechanical properties of the gold fine lead/gold pad), transition of the bonding mechanism by the bonding load increase, the promoting effect of the wire deformation with the pad temperature increase, and the effects of the bonding tool shape on the interconnection formation, etc.were clarified. And also, … More the analysis for adhesional bonding mechanism at room temperature which is expected to be very important in the near future were carried out in the present study, and the increase phenomenon of the bond strength with the time after bonding was investigated and the mechanism was clarified. The results that were concretely obtained in the present study are classified into the following 8 points.1) The effect of material properties, bonding pressure, bonding temperature on the bonding process were analyzed.2) The analysis of the interfacial diffusion behavior between pad and fine wires and the change in the stress distribution with time.3) The transition of adhesional bonding mechanism with the bonding load increase.4) The numerical simulation of deformation process of pad and gold fine wire.5) The analysis of the effect of the bonding tool on the bonding process.6) Effect on the bonded interface extension of the pad thickness and effectiveness of the gold bump for the microjoining.7) Theory of adhesional bonding process between gold fine wire and pad, and also the quantification.8) Numerical examination of the bonded interface migration phenomenon and the abnormal formation of the grain boundary groove. Less