reversible interconnection

提出了可逆互连的新概念，利用可逆互连可以实现任意材料组合的可逆粘结和分离。从回收材料的角度来看，无机材料的分离也很重要。然而，很少有人尝试设计可根据场合需要分离的材料互连。为了证明可逆互连的概念，研究了两种分离技术：通过形成反应产物来削弱键合界面和通过吸氢引起的内部应变来削弱键合界面。由于工艺温度较高，在连接过程中会形成脆性反应层，很难用扩散连接等常规方法进行连接。在室温下，采用表面活化连接(SAB)的方法成功地实现了它们的连接。在键合过程中，表面在真空中被离子束或原子束照射激活，然后相互接触。接头的抗拉强度高达20 Mpa。在823K下加热7.2ks，在界面上析出Al_(76)&gt；Fe_(？)lt；24&gt；Al_5Fe_2FeAl_2。因此，可以在不施加任何外部机械力的情况下在界面处分离接头。第二种分离技术以多晶铜和Al-LaNi；4.5&gt；Al_&lt；0.5&gt；同样在这种情况下，由于储氢合金的退化可能是由传统键合工艺的高温引起的，因此在室温下由SAB执行键合。将接头置于20-50atm的氢气气氛中后，可以观察到接头在结合界面处的分离。

A new concept of reversible interconnection is proposed, by which any material combination can be bonded and separated reversibly. Separation of inorganic materials is important also from the point of view of recycling the materials. Few attempt, however, has been made for designing materials interconnections which can be separated as occasion demands. To demonstrate the concept of the reversible interconnection, two techniques of separation were investigated : weakening bonded interface i) by formation of reaction products and ii) by internal strain induced by hydrogen absorption.The first case is demonstrated by polycrystalline Al and stainless steel interface. It is difficult to bond them by the conventional technique like diffusion bonding, because a brittle reaction layr is formed during the bonding due to the high process temperature. Their joining was carried out successfully by means of the surface activated bonding (SAB) at room temperature. In the bonding procedure, the surfaces are activated by ion or atom beam irradiation in vacuum and then brought into contact to each other. The tensile strength of the joint reaches as high as 20 Mpa. By heating the joint at 823K for 7.2ksec, Al_<76>Fe_<24>, Al_5Fe_2 FeAl_2 were precipitated at the interface. As a result, the joint could be separated at the interface without applying any external mechanical force. The separation occurred between the reaction layr and Al.The second separation technique is demonstrated by polycrystalline Cu-, and Al-LaNi_<4.5>Al_<0.5> joint. Also in this case, the bonding is performed by the SAB at room temperature, since degradation of the hydrogen storage alloy might be caused by high temperature of the conventional bonding process. After exposing the joint to hydrogen atmosphere of 20-50atm, separation of the joint at the bonded interface could be observed.