A new lapping process for difficult-to-machine brittle materials

该项目旨在解决难以加工的光电子脆性材料的常规研磨中的及时瓶颈问题。一种用于制造此类材料的创新的化学增强研磨技术有望减少机械加工的亚表面损害。这一点意义重大，因为它将缩短后续的精加工过程，并将制造成本降至最低。该项目的预期成果还包括先进的加工理论和材料去除特性方面的创新。这项突破性技术将有助于为能源、医药和通信行业设计和制造高性能电子设备，并对澳大利亚经济产生相当大的影响。

This project aims to address a timely bottleneck issue in the conventional lapping of difficult-to-machine optoelectronic brittle materials. An innovative chemically enhanced lapping technology for fabricating such materials is expected to reduce machined subsurface damage. This is significant because it would shorten the subsequent finishing process and minimise the manufacturing cost. Intended outcomes from this project also include an advanced machining theory and innovations in material removal characterisation. This breakthrough technology should benefit the design and fabrication of high performance electronic devices for energy, medicine and communication sectors with considerable impact on the Australian economy.