LOW MASS LOW POWER RADIATION RESISTANT PIXEL MODULES

粒子物理学家希望以高保真和100%的效率重建物理相互作用产物的轨迹。为此，成功的秘诀是众所周知的：高分辨率的最小质量探测器系统。虽然现代碳复合材料和新的冷却概念能够实现较低质量的系统，但实现较低质量的关键是低功率探测器模块。本项目解决了通过将传感器元件替换为cmos传感器来获得低功率像素组件的关键要素。CMOS型传感器也将取代模拟放大的第一级。这将减少传感器和读出电子设备中的功耗。将开发的CMOS传感器是基于汽车电子控制中常用的HVCMOS技术的应用。该HVCMOS传感器具有耗尽的感测体积，即使在照射后也可以进行快速和充分的电荷收集。这与大多数CMOS传感器技术不同，后者依赖较慢的漂移过程，受非电离辐射损伤的影响很大。ROIC仍将用于处理来自传感器的数据，就像在标准像素混合组装中所做的那样。这样做的优点是可以充分利用ROIC的全部功率。HVCMOS传感器通过一个简单的胶水接头连接到标准的粒子物理读出像素芯片。该信号被电容地从HVCMOS传感器耦合到ROIC。这种简单的组装程序和廉价的传感器将显著降低像素模块的生产成本，这将使它们在粒子物理实验中得到更广泛的应用。由于组装过程非常简单，将两件物品粘合在一起，有可能将两个设备都减薄到50-100微米，这将导致模块的质量减少。

Particle physicists wish to reconstruct with high fidelity and 100% efficiency the trajectories of the products from physics interactions. For this the secret for success is well known: high-resolution minimal mass detector systems. While modern carbon composites, and novel cooling concepts enable a lower mass system, the key to low mass is a low power detector module.This project addresses the key elements to obtain a low power pixel assembly by replacing the sensor element with a CMOS sensor. The CMOS sensor will also replace the first stage of the analogue amplification. This will reduce the power dissipated in the sensor and the readout electronics.The CMOS sensors to be developed is based on an application of the HVCMOS technology commonly used for automotive electronics control. The HVCMOS sensor has a depleted sensing volume that allows fast and full charge collection even after irradiation. This is unlike most CMOS sensor technologies which rely on a slower drift process that is significantly affected by non-ionizing radiation damage.The ROIC will still be used to process the data from the sensor as done in a standard pixel hybrid assembly. The advantage of this is to allow the full power of the ROIC to be utilized.The HVCMOS sensor is attached with a simple glue joint to a standard Particle physics readout pixel chip. The signal is capacitivly coupled from the HVCMOS sensor to the ROIC. This simple assembly procedure, and cheap sensor, will significantly reduce the cost of the production of pixel modules which will allow them to be used more widely in particle physics experiments. Therefore extending the physics reach of a given experiment.As the assembly procedure is very straight forward, gluing two items together, it will be possible to thin both the devices down to 50-100 micrometers each which will result in a mass reduction in the module.