课题基金 / 基金详情

Photodetection with multi-GHz bandwidth in a CMOS integrated circuit

Photodetection with multi-GHz bandwidth in a CMOS integrated circuit
CMOS 集成电路中具有多 GHz 带宽的光电检测
批准号:
401625-2010
负责人:
ChanCarusone, Anthony
金额:
$8.61万
依托单位:
依托单位国家:
加拿大
项目类别:
Idea to Innovation
财政年份:
2010
资助国家:
加拿大
项目状态:
已结题
起止时间:
2010-01-01 至 2011-12-31

项目摘要

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中文摘要
翻译
如今的光通信解决方案使用了许多分立组件,每个组件都经过单独优化,以实现高速下的最大性能,并使用特殊技术制造。具体来说,用于将高速光信号转换为电信号的组件是关键且昂贵的。我们最近的研究表明,信号处理允许使用光电转换器,该转换器可以使用相同的低成本制造工艺直接与电子电路一起制造。我们已经用这项技术演示了一个运行速度高达5gbps的完整光学接收器,足以在不到1分钟的时间内传输一整部蓝光电影。该原型接受光输入并产生数字逻辑输出,所有这些都在一个小于1平方毫米的硅芯片上,并使用主流制造技术制造。这一突破的时机是偶然的,因为它与光纤技术的进步相吻合,光纤技术正在为光通信带来一系列令人兴奋的新应用。该项目将看到该技术结合了一个能够同时通过多个平行光纤发送和接收的并行收发器。该提案概述了实现这一目标的计划,并在9个月内展示了平行联系,使技术准备好转让给商业化伙伴。
英文摘要
Optical communication solutions today make use of many discrete components, each individually optimized for maximum performance at high speed and fabricated using exotic technologies. Specifically, the components used to convert high-speed light signals into electrical signals are critical and expensive. Our recent research has demonstrated signal processing that allows for the use of an optical-electrical converter that may be fabricated directly alongside electronic circuitry using the same low-cost manufacturing processes. We have already used the technology to demonstrate a complete optical receiver operating up to 5 Gbps, sufficient to transfer an entire Blu-Ray movie in less than 1 minute. The prototype accepts an optical input and produces a digital logic output all on a single silicon die measuring less than 1 square millimetre and fabricated using a mainstream manufacturing technology. The timing of this breakthrough is serendipitous as it coincides with advances in optical fibre technology that are ushering in a new set of exciting applications for optical communication. This project will see the technology incorporated a parallel transceiver capable of transmitting and receiving over multiple parallel optical fibers simultaneously. This proposal outlines a plan to meet this objective and demonstrate a parallel link in 9 months, making the technology ready for transfer to commercialization partners.
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Optimized Terabit-per-second Chip-to-Chip Communication over Heterogeneous Interconnect Fabrics
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  • 项目类别:
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