Scanning Acoustic Microscope to Probe Voids and Interfaces in Functionalized Materials and Hybrid Devices

Ecole Polytech最近部署的晶片键合能力为开发新型混合器件创造了大量机会，允许在同一平台上大规模集成具有不同性能的材料，从而实现单一的多功能实体。为了充分发挥这种异质集成的潜力，评估粘接界面的质量及其在加工过程中的行为是至关重要的。不同材料之间的界面在形成工程异质结构的物理、化学、光学和电学性质方面起着核心作用，因此决定了各种当前和新兴的混合技术的可靠性和性能。因此，对界面的精确检测对于验证制造的混合器件的质量和跟踪其长期稳定性至关重要，这对于优化各种制造、功能化和集成工艺具有非常重要的意义。带着这一观点，为了建立与我们的晶片键合设施相辅相成的表征基础设施，我们寻求建立一种扫描声学显微镜，以实现对埋入界面的非破坏性、高分辨率和高灵敏度的成像。这种显微镜的工作原理就像声纳一样，发送高频声信号，并测量反射回探测器所需的时间。它对两个连接面之间的空洞、空洞、孔隙率、分层、裂纹和颗粒特别敏感，从而为了解材料的微观结构特征提供了有价值的见解。显微镜将由显微制造实验室管理，该实验室拥有最先进的设施，所有来自公共和私营部门的研究人员都可以使用。该显微镜将是推动微电子学、光电子学、光子学、光伏、微流体、机电和表面涂层技术研究活动的核心。收购SAM还将提供一个极好的机会，以加强对高素质人员的培训

The recently deployed wafer bonding capabilities at Ecole Polytechnique create a wealth of opportunities to develop a new class of hybrid devices by allowing large scale integration of materials with different properties in the same platform thereby achieving single multifunctional entities. Assessing the quality of bonded interface and its behavior during processing is of the utmost importance in order to exploit the full potential of this heterogeneous integration. The interface between dissimilar materials plays a central role in shaping the physical, chemical, optical, and electrical properties of engineered heterostructures and hence defines the reliability and performance of a variety of current and emerging hybrid technologies. Therefore, a precise inspection of interfaces is crucial to verify the quality of the fabricated hybrid devices and to track their long-term stability, which is of compelling importance to optimize various fabrication, functionalization, and integration processes. With this perspective and to establish the characterization infrastructure that complements our wafer bonding facilities, we seek to set up a scanning acoustic microscope, which enables a non-destructive, high resolution, and sensitive imaging of buried interfaces. This microscope works like a sonar, sending a high frequency acoustic signal and measuring the time it takes to reflect back to the detector. It is particularly sensitive to voids, cavities, porosity, delaminations, cracks, and particles trapped between two joint surfaces thus providing valuable insights into microstructural characteristics of materials. The microscope will be managed by the Microfabrication Laboratory which hosts state-of-the-art facilities accessible to all researchers from public and private sectors. The microscope will be central to advance research activities in microelectronics, optoelectronics, photonics, photovoltaics, microfluidics, electromechanics, and surface coating technologies. The acquisition of the SAM will also offer an excellent opportunity to enhance the training of highly qualified personnel