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An Integrated Smart Power Harvesting Scheme from High Throughput Data Lines

An Integrated Smart Power Harvesting Scheme from High Throughput Data Lines
高吞吐量数据线的集成智能电力收集方案
批准号:
463394-2014
负责人:
Sawan, Mohamad
金额:
$14.13万
依托单位国家:
加拿大
项目类别:
Strategic Projects - Group
财政年份:
2015
资助国家:
加拿大
项目状态:
已结题
起止时间:
2015-01-01 至 2016-12-31

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中文摘要
翻译
在有线传感器网络中,传感器和控制单元之间的安全可靠的数据通信以及向它们获取能量需要庞大的布线束。另一方面,数据总线预计会有相当长的空闲时间。因此,一种很有前途的方法是利用空闲时间来分配能量,从而为传感器及其接口节省和获取电力。当该技术与宽带隙和高压集成电路技术一起实现时,可以将应用范围扩展到那些受到恶劣和高压环境影响的人。
英文摘要
In a wired sensor network, safe and reliable data communications between sensors and control units, and procuring energy to them involve bulky wiring bundles. On the other hand, significant idle period are expected in the data buses. Therefore, a promising means of saving and procuring power to sensors and their interfaces could be based on exploiting idle periods to distribute energy. the technique when implemented with wide bandgap and high voltage IC technologies can extend the application to those who are subject to harsh and high voltage environments. Our goal is to introduce new power up techniques for wired networks, sensor networks in particular, where many lines carry data and power separately. The project aims at serving the benefits to a broad range of applications, which are subjected to simultaneous data and power transfer, notably found in aerospace. Each of these main subjects must contribute to define an appropriate architecture to facilitate reliable interconnection and This project tackles solutions to introduce a power scavenging scheme from data lines to feed energy to peripherals in sensor networks. The research consists of the following complementary parts; a) development of a smart power management algorithm, b) investigation of the best means to combine data transfers and energy scavenging over a same medium, c) development of wide bandgap devices and their characterization, d) adaptation of the scheme to harsh environmental conditions such as high temperature, e) introduction of power efficient high voltage line (sine) driver for excitation signal generator path in sensor interfaces, and f) miniaturization and packaging of the circuits using COT and IC components. Here, standard and high-voltage CMOS, hybrid and wide bandgap technologies are involved.
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