DAMAGELESS ETCHING PROCESSES

等离子体蚀刻技术应用于微纳米制造中，需要对各种材料进行精确的图像化。然而，它也会对蚀刻材料的表面造成损伤。这些修改对设备性能的确切影响尚不完全清楚。在这个项目中，我们打算提高对等离子体诱导损伤的理解，并评估减少损伤的解决方案。我们将以硅、III-V材料和超导材料作为试验载体。这些材料用于集成电路、高效太阳能电池和量子计算设备的制造。我们的研究将基于对暴露在等离子体中的材料表面的广泛表征。等离子体诊断还将用于将材料改性与等离子体特性联系起来。基于这些信息，我们将开发具有最小等离子体诱导损伤的工艺，并将研究替代等离子体蚀刻工艺。该计划将提供参与制造新设备的工艺，如更高效率的太阳能电池或量子计算机。此外，它还将培养五名高素质的人才，他们将为整合高科技产业和开发有利于加拿大经济的新产品做好准备。

Plasma etching used in micro and nano fabrication is required for precise patterning of various materials. However, it also induces damage at the surface of the etched materials. The exact impact of these modifications on devices properties is not fully understood yet.In this program, we intend to improve the understanding of plasma-induced damage and to evaluate solutions to reduce the damage. We will use silicon, III-V materials and superconducting materials as test vehicles. These materials are used for integrated circuits, high efficiency solar cells and quantum computing devices fabrication. We will base our research on an extensive characterization of the surface of materials exposed to the plasma. Plasma diagnostics will also be used to correlate materials modification with plasma properties. Based on this information, we will develop processes with minimal plasma-induced damage and we will investigate alternative plasma etching processes. This program will provide processes that will participate in the fabrication of new devices such as higher efficiency solar cells or quantum computers. In addition, it will train five highly qualified people who will be well prepared to integrate the high tech industry and develop new products which will benefit Canada's economy.