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RIA: Research on Partitioning for High Speed and High Density Circuit Design

RIA: Research on Partitioning for High Speed and High Density Circuit Design
RIA:高速高密度电路设计分区研究
批准号:
9009260
负责人:
Chung-Kuan Cheng
金额:
$6.8万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1990
资助国家:
美国
项目状态:
已结题
起止时间:
1990-07-01 至 1992-06-30

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中文摘要
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英文摘要
This research is on performance driven partitioning for high speed and high density circuit design. Tools for an automatic partitioning system which divides circuits from the system level to basic layout modules are being developed. For systems of several million gates, a technique, called the ratio cut, is used to define the hierarchy of the system. The ratio cut is used to identify the cluster structure and thus organize the system into a tree structure. A heuristic ratio cut algorithm is being explored for use in hierarchal partitioning of the design. Once a partition has been made there is an optimization problem. Solutions to this problem are being investigated using neural nets, partitioning on special graphs and other methods.
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